U.S. patent number D871,466 [Application Number D/633,932] was granted by the patent office on 2019-12-31 for rotary tool for boat of semiconductor manufacturing apparatus.
This patent grant is currently assigned to KOKUSAI ELECTRIC CORPORATION. The grantee listed for this patent is Hitachi Kokusai Electric Inc.. Invention is credited to Hiromi Okada, Yoshikazu Takashima.
![](/patent/grant/D0871466/USD0871466-20191231-D00000.png)
![](/patent/grant/D0871466/USD0871466-20191231-D00001.png)
![](/patent/grant/D0871466/USD0871466-20191231-D00002.png)
![](/patent/grant/D0871466/USD0871466-20191231-D00003.png)
![](/patent/grant/D0871466/USD0871466-20191231-D00004.png)
United States Patent |
D871,466 |
Okada , et al. |
December 31, 2019 |
Rotary tool for boat of semiconductor manufacturing apparatus
Claims
CLAIM The ornamental design for a rotary tool for boat of
semiconductor manufacturing apparatus, as shown and described.
Inventors: |
Okada; Hiromi (Toyama,
JP), Takashima; Yoshikazu (Toyama, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi Kokusai Electric Inc. |
Toyama |
N/A |
JP |
|
|
Assignee: |
KOKUSAI ELECTRIC CORPORATION
(Tokyo, JP)
|
Appl.
No.: |
D/633,932 |
Filed: |
January 17, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Jul 25, 2017 [JP] |
|
|
2017-016039 |
|
Current U.S.
Class: |
D15/130; D15/140;
D8/349 |
Current International
Class: |
1509 |
Field of
Search: |
;D13/182,184,199
;D15/4,5,9,29,130,140,199,144,144.1
;D8/8,14,36,61,337,349,352,373,499 ;D18/10,34.8,40 ;D24/232,234
;D32/19,25,29,32,33,35 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a front, top and right side perspective view of a rotary
tool for boat of semiconductor manufacturing apparatus showing our
new design;
FIG. 2 is a rear, bottom and left side perspective view
thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
* * * * *