U.S. patent number D850,407 [Application Number D/627,197] was granted by the patent office on 2019-06-04 for earphones.
This patent grant is currently assigned to Shenzhen Kingvie Technology Co., Ltd.. The grantee listed for this patent is Shenzhen Kingvie Technology Co., Ltd. Invention is credited to Zuoqiang Li.
United States Patent |
D850,407 |
Li |
June 4, 2019 |
Earphones
Claims
CLAIM The ornamental design for a set of earphones, as shown and
described.
Inventors: |
Li; Zuoqiang (Shenzhen,
CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shenzhen Kingvie Technology Co., Ltd |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
Shenzhen Kingvie Technology Co.,
Ltd. (Shenzhen, CN)
|
Appl.
No.: |
D/627,197 |
Filed: |
November 22, 2017 |
Foreign Application Priority Data
|
|
|
|
|
May 24, 2017 [CN] |
|
|
2017 3 0197421 |
|
Current U.S.
Class: |
D14/205;
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/204,205,206,223,224,225,249,372,433,138R,188,192,172,203.1,191,496
;D29/112 ;D28/41 ;D2/875 ;D24/174,173,106 ;D8/330,341
;D13/118,108,119 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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303640463 |
|
Apr 2016 |
|
CN |
|
303640491 |
|
Apr 2016 |
|
CN |
|
303825866 |
|
May 2016 |
|
CN |
|
303900149 |
|
Oct 2016 |
|
CN |
|
303931339 |
|
Nov 2016 |
|
CN |
|
303978559 |
|
Dec 2016 |
|
CN |
|
304014001 |
|
Jan 2017 |
|
CN |
|
3040299949 |
|
Feb 2017 |
|
CN |
|
304065726 |
|
Mar 2017 |
|
CN |
|
303019628 |
|
Dec 2017 |
|
CN |
|
304731772 |
|
Jul 2018 |
|
CN |
|
Other References
BeatsX may be the company's best new wireless headphones, published
Sep. 29, 2016 [online], [retrieved Dec. 12, 2018], Available from
Internet, URL: <https://www.youtube.com/watch?v=u4GynjGnrME>.
cited by examiner .
Unboxing tai nghe bluetooth gia re JBL T110BT 3Kshop, published
Oct. 19, 2017 [online], [retrieved Dec. 12, 2018], Available from
Internet, URL: <https://www.youtube.com/watch?v=Z99XQS9IWLM>.
cited by examiner.
|
Primary Examiner: Fox; Barbara
Assistant Examiner: Ramirez; Mary C
Description
FIG. 1 is a front perspective view of a set of earphones showing my
new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown in the drawings depict portions of the set
of earphones that form no part of the claimed design.
* * * * *
References