U.S. patent number D803,816 [Application Number D/576,014] was granted by the patent office on 2017-11-28 for pair of headphones.
This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Michael Bolster.
United States Patent |
D803,816 |
Bolster |
November 28, 2017 |
Pair of headphones
Claims
CLAIM The ornamental design for a pair of headphones, as shown and
described.
Inventors: |
Bolster; Michael (Pittsburgh,
PA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Harman International Industries, Incorporated |
Northridge |
CA |
US |
|
|
Assignee: |
Harman International Industries,
Incorporated (Northridge, CA)
|
Appl.
No.: |
D/576,014 |
Filed: |
August 31, 2016 |
Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/223,205 ;D24/174
;128/865,866 ;181/129,130,135 ;379/430,431
;381/380,381,382,384,370,379 ;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is a back perspective view of a left headphone of a pair of
headphones showing my new design;
FIG. 2 is a front perspective view of the headphone of FIG. 1;
FIG. 3 is a back elevational view of the headphone of FIG. 1;
FIG. 4 is a front elevational view of the headphone of FIG. 1;
FIG. 5 is a right side elevational view of the headphone of FIG.
1;
FIG. 6 is a left side elevational view of the headphone of FIG.
1;
FIG. 7 is a top plan view of the headphone of FIG. 1;
FIG. 8 is a bottom plan view of the headphone of FIG. 1;
FIG. 9 is a back perspective view of a right headphone of a pair of
headphones of my new design;
FIG. 10 is a front perspective view of the headphone of FIG. 9;
FIG. 11 is a back elevational view of the headphone of FIG. 9;
FIG. 12 is a front elevational view of the headphone of FIG. 9;
FIG. 13 is a right side elevational view of the headphone of FIG.
9;
FIG. 14 is a left side elevational view of the headphone of FIG.
9;
FIG. 15 is a top plan view of the headphone of FIG. 9; and,
FIG. 16 is a bottom plan view of the headphone of FIG. 9.
The broken line showings and unshaded areas depict environment that
forms no part of the claimed design.
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