U.S. patent number D841,537 [Application Number D/637,807] was granted by the patent office on 2019-02-26 for rear bumper for an automobile.
This patent grant is currently assigned to HONDA MOTOR CO., LTD.. The grantee listed for this patent is HONDA MOTOR CO., LTD.. Invention is credited to Tetsuji Morikawa.
United States Patent |
D841,537 |
Morikawa |
February 26, 2019 |
Rear bumper for an automobile
Claims
CLAIM The ornamental design for a rear bumper for an automobile, as
shown and described.
Inventors: |
Morikawa; Tetsuji (Saitama,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
HONDA MOTOR CO., LTD. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
HONDA MOTOR CO., LTD. (Tokyo,
JP)
|
Appl.
No.: |
D/637,807 |
Filed: |
February 22, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Aug 31, 2017 [JP] |
|
|
2017-018786 |
|
Current U.S.
Class: |
D12/169 |
Current International
Class: |
1216 |
Field of
Search: |
;D12/169,102,113,115,117,120 ;296/180.1,180.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Brown; Melody N
Attorney, Agent or Firm: Westerman, Hattori, Daniels &
Adrian, LLP
Description
FIG. 1 is a front and left side perspective view of a rear bumper
for an automobile showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side view thereof; and,
FIG. 5 is a right side view thereof.
The broken lines in the drawings illustrate portions of the rear
bumper for an automobile that form no part of the claimed
design.
* * * * *