U.S. patent number D824,818 [Application Number D/598,687] was granted by the patent office on 2018-08-07 for rear bumper for an automobile.
This patent grant is currently assigned to HONDA MOTOR CO., LTD.. The grantee listed for this patent is HONDA MOTOR CO., LTD.. Invention is credited to Tetsuji Morikawa, Masanori Tokutani.
United States Patent |
D824,818 |
Morikawa , et al. |
August 7, 2018 |
Rear bumper for an automobile
Claims
CLAIM The ornamental design for a rear bumper for an automobile, as
shown and described.
Inventors: |
Morikawa; Tetsuji (Wako,
JP), Tokutani; Masanori (Wako, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
HONDA MOTOR CO., LTD. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
HONDA MOTOR CO., LTD. (Tokyo,
JP)
|
Appl.
No.: |
D/598,687 |
Filed: |
March 28, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Sep 30, 2016 [JP] |
|
|
2016-021117 |
|
Current U.S.
Class: |
D12/169 |
Current International
Class: |
1216 |
Field of
Search: |
;D12/169,216,90-92,86,171,196,163 ;293/102,113,115,117,120
;296/180.1,180.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Brown; Melody N
Attorney, Agent or Firm: Westerman, Hattori, Daniels &
Adrian, LLP
Description
FIG. 1 is a top, front and left side perspective view of a rear
bumper for an automobile showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
The broken lines in the drawings illustrate portions of the rear
bumper for an automobile that form no part of the claimed
design.
* * * * *