Cover ring for a plasma processing apparatus

Ichino , et al. Feb

Patent Grant D840365

U.S. patent number D840,365 [Application Number D/610,999] was granted by the patent office on 2019-02-12 for cover ring for a plasma processing apparatus. This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hitachi High-Technologies Corporation. Invention is credited to Takamasa Ichino, Kazunori Nakamoto, Kohei Sato.


United States Patent D840,365
Ichino ,   et al. February 12, 2019

Cover ring for a plasma processing apparatus

Claims

CLAIM The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.
Inventors: Ichino; Takamasa (Tokyo, JP), Sato; Kohei (Tokyo, JP), Nakamoto; Kazunori (Tokyo, JP)
Applicant:
Name City State Country Type

Hitachi High-Technologies Corporation

Minato-ku, Tokyo

N/A

JP
Assignee: Hitachi High-Technologies Corporation (Tokyo, JP)
Appl. No.: D/610,999
Filed: July 18, 2017

Foreign Application Priority Data

Jan 31, 2017 [JP] 2017-001755
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/158-177,182,184 ;204/286.1,297.1 ;205/118,123 ;200/1R,5R,52R,315,310,6A,302.1,308,314,317,11R,16B

References Cited [Referenced By]

U.S. Patent Documents
D404369 January 1999 Kawachi
D491963 June 2004 Doba
D494551 August 2004 Doba
7186171 March 2007 Oh
D557226 December 2007 Uchino et al.
D557425 December 2007 Nakamura et al.
D559993 January 2008 Nagakubo
D559994 January 2008 Nagakubo et al.
D638550 May 2011 Bedingham
D638951 May 2011 Bedingham
D667561 September 2012 Bedingham
D717746 November 2014 Lau
D770992 November 2016 Tauchi et al.
D802545 November 2017 Tauchi
D802790 November 2017 Tauchi
2003/0066484 April 2003 Morikage
2005/0150452 July 2005 Sen
2005/0258280 November 2005 Goto
2008/0121620 May 2008 Guo
Foreign Patent Documents
D1210213 Jun 2004 JP
D1361441 Jun 2009 JP
D1551512 Jun 2016 JP

Other References

Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017. cited by applicant .
Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017. cited by applicant .
Ichino et al., Design U.S. Appl. No. 29/610,998, filed Jul. 18, 2017. cited by applicant .
Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Crowell & Moring LLP

Description



This application contains subject matter related to the following co-pending U.S. design patent applications:

Application Ser. No. 29/610,995, filed herewith and entitled "Electrode Cover for a Plasma Processing Apparatus";

Application Ser. No. 29/610,996, filed herewith and entitled "Electrode Cover for a Plasma Processing Apparatus";

Application Ser. No. 29/610,998, filed herewith and entitled "Ring for a Plasma Processing Apparatus"; and

Application Ser. No. 29/611,001, filed herewith and entitled "Discharge Chamber for a Plasma Processing Apparatus".

FIG. 1 is a front, top and right side perspective view of a cover ring for a plasma processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2;

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 4;

FIG. 10 is an enlarged view of the portion shown in BOX 10 in FIG. 8; and,

FIG. 11 is a front, top, and left side perspective view of FIG. 8.

The box labelled as 10 in FIG. 8 is shown in broken lines and forms no part of the claimed design.

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Patent Diagrams and Documents

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