U.S. patent number D840,365 [Application Number D/610,999] was granted by the patent office on 2019-02-12 for cover ring for a plasma processing apparatus. This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hitachi High-Technologies Corporation. Invention is credited to Takamasa Ichino, Kazunori Nakamoto, Kohei Sato.
United States Patent | D840,365 |
Ichino , et al. | February 12, 2019 |
Inventors: | Ichino; Takamasa (Tokyo, JP), Sato; Kohei (Tokyo, JP), Nakamoto; Kazunori (Tokyo, JP) | ||||||||||
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Applicant: |
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Assignee: | Hitachi High-Technologies
Corporation (Tokyo, JP) |
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Appl. No.: | D/610,999 | ||||||||||
Filed: | July 18, 2017 |
Jan 31, 2017 [JP] | 2017-001755 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/158-177,182,184 ;204/286.1,297.1 ;205/118,123 ;200/1R,5R,52R,315,310,6A,302.1,308,314,317,11R,16B |
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Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017. cited by applicant . Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017. cited by applicant . Ichino et al., Design U.S. Appl. No. 29/610,998, filed Jul. 18, 2017. cited by applicant . Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017. cited by applicant. |
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