U.S. patent number D826,210 [Application Number D/606,053] was granted by the patent office on 2018-08-21 for headphone.
This patent grant is currently assigned to RAZER (ASIA-PACIFIC) PTE. LTD.. The grantee listed for this patent is RAZER (ASIA-PACIFIC) PTE. LTD.. Invention is credited to Boon Sim Chong.
United States Patent |
D826,210 |
Chong |
August 21, 2018 |
Headphone
Claims
CLAIM I claim the ornamental design for a headphone, as shown and
described.
Inventors: |
Chong; Boon Sim (Singapore,
SG) |
Applicant: |
Name |
City |
State |
Country |
Type |
RAZER (ASIA-PACIFIC) PTE. LTD. |
Singapore |
N/A |
SG |
|
|
Assignee: |
RAZER (ASIA-PACIFIC) PTE. LTD.
(Singapore, SG)
|
Appl.
No.: |
D/606,053 |
Filed: |
June 1, 2017 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,188,192
;D29/112 ;2/209 ;181/129,130,135 ;379/430,431
;381/380,381,74,370,374 ;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Polsinelli PC
Description
FIG. 1 is a perspective view of an embodiment of a headphone,
showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Broken lines are for illustrating unclaimed portions of the
headphone; the broken lines form no part of the claimed design.
Any change in scale between different views is not intended to
limit the headphone to a particular size.
* * * * *