Flexible printed wiring board with device

Mori , et al. February 20, 2

Patent Grant D810707

U.S. patent number D810,707 [Application Number D/586,563] was granted by the patent office on 2018-02-20 for flexible printed wiring board with device. This patent grant is currently assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD.. The grantee listed for this patent is Sumitomo Electric Industries, Ltd.. Invention is credited to Yoshiya Abiko, Makoto Inagaki, Takashi Iwasaki, Rui Mikami, Koji Mori, Youichi Nagai, Kenji Saito, Kazumasa Toya.


United States Patent D810,707
Mori ,   et al. February 20, 2018

Flexible printed wiring board with device

Claims

CLAIM The ornamental design for a flexible printed wiring board with device, as shown and described.
Inventors: Mori; Koji (Osaka, JP), Iwasaki; Takashi (Osaka, JP), Toya; Kazumasa (Osaka, JP), Saito; Kenji (Osaka, JP), Abiko; Yoshiya (Osaka, JP), Nagai; Youichi (Osaka, JP), Inagaki; Makoto (Osaka, JP), Mikami; Rui (Osaka, JP)
Applicant:
Name City State Country Type

Sumitomo Electric Industries, Ltd.

Osaka-shi, Osaka

N/A

JP
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD. (Osaka, JP)
Appl. No.: D/586,563
Filed: December 5, 2016

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29507495 Oct 28, 2014 D784936

Foreign Application Priority Data

May 28, 2014 [JP] 2014-011388
May 28, 2014 [JP] 2014-011394
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/155,182 ;174/68.1,68.2,68.3,250,253,254,255,256,257,258,260

References Cited [Referenced By]

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Other References

Japanese Office Action for related Japanese Design Patent Application No. 2014-011387 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Patent Application No. 2014-011389 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Patent Application No. 2014-011390 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Patent Application No. 2014-011391 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Patent Application No. 2014-011392 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Patent Application No. 2014-011393 dated Feb. 9, 2015, 2 Pages. cited by applicant .
Japanese Office Action for related Japanese Design Patent Application No. 2014-011388 dated Jul. 6, 2015, 2 Pages. cited by applicant .
Oki Electric Cable, "Oki Electric Cable Develops Industry's First FPC for Three-dimension Wiring", Jun. 11, 2008, 5 Pages. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Ditthavong & Steiner, P.C.

Description



FIG. 1 is a front view of a flexible printed wiring board with device shown in a used condition mounted on a photovoltaic power device for a photovoltaic module or a light emitting diode device for a light emitting diode module shown in broken lines showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is an enlarged top plan view of a portion taken along lines 7-7 of FIG. 3;

FIG. 8 is an enlarged bottom plan view of a portion taken along lines 8-8 of FIG. 4;

FIG. 9 is an enlarged front view of a portion taken along lines 9-9 of FIG. 1;

FIG. 10 is an enlarged rear view of a portion taken along lines 10-10 of FIG. 2;

FIG. 11 is a right side view of FIG. 7; and,

FIG. 12 is an enlarged left side view of FIG. 6.

The even dashed broken lines shown in the drawings represent portions of the flexible printed wiring board with device that form no part of the claimed design. The long dashed and short dashed line indicates only a boundary line between the claimed and unclaimed areas of the design.

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