Pair of headphones
Damboulev , et al. January 9, 2
Patent Grant D807322
U.S. patent number D807,322 [Application Number D/569,404] was granted by the patent office on 2018-01-09 for pair of headphones. This patent grant is currently assigned to KAY TECHNOLOGIES, LLC. The grantee listed for this patent is KAY Technologies, LLC. Invention is credited to Kristian Damboulev, Joaquin Nicholas Herlein.
| United States Patent | D807,322 |
| Damboulev , et al. | January 9, 2018 |
Pair of headphones
Claims
CLAIM An ornamental design for a pair of headphones, as shown and described.
| Inventors: | Damboulev; Kristian (West Hollywood, CA), Herlein; Joaquin Nicholas (Buenos Aires, AR) | ||||||||||
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| Applicant: |
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| Assignee: | KAY TECHNOLOGIES, LLC (Culver
City, CA) |
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| Appl. No.: | D/569,404 | ||||||||||
| Filed: | June 27, 2016 |
| Current U.S. Class: | D14/205; D14/226 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,188,192,224,225-228 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,74,375,379,384,370,151 ;455/90.3,575.1,569.1 ;D9/430,431 ;D28/78 |
References Cited [Referenced By]
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Other References
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Design U.S. Appl. No. 29/569,403, filed Jun. 27, 2016 (which is owned by the owner of this Application), and its ongoing prosecution history, including without limitation Office Actions, Amendments, Remarks, prior art references, and any other potentially relevant documents or statements. cited by applicant. |
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Proven Patents Law Firm Koch; Kregg A.
Description
FIG. 1 is a first perspective view of an embodiment of a pair of headphones.
FIG. 2 is a second perspective view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 3 is a top view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 4 is a bottom view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 5 is a first side view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 6 is a second side view of the embodiment of the pair of headphones shown in FIG. 1, the second side being generally opposite to the first side shown in FIG. 5.
FIG. 7 is a front view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 8 is a back view of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 9 is an enlarged, perspective view of a first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 10 is an enlarged, top view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 11 is an enlarged, bottom view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 12 is an enlarged, side view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1, showing an outside surface of the first earpiece portion.
FIG. 13 is an enlarged, side view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1, showing an inside surface of the first earpiece portion.
FIG. 14 is an enlarged, front view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 15 is an enlarged, back view of the first earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 16 is an enlarged, perspective view of a second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 17 is an enlarged, top view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 18 is an enlarged, bottom view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
FIG. 19 is an enlarged, side view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1, showing an outside surface of the second earpiece portion.
FIG. 20 is an enlarged, side view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1, showing an inside surface of the second earpiece portion.
FIG. 21 is an enlarged, front view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1; and,
FIG. 22 is an enlarged, back view of the second earpiece portion of the embodiment of the pair of headphones shown in FIG. 1.
The broken lines depict environmental structure and form no part of the claimed design.
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