Headphone

Description

FIG. 1 and is a front perspective view of a headphone showing my new design;

FIG. 2 is a front elevational view thereof

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines form no part of the claimed design.

Claims

CLAIM The ornamental design for a headphone, as shown and described.

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Inventors:	Yang; Yong (Shenzhen, CN)
Applicant:	Name City State Country Type Shenzhen Soundsoul Information Technology Co. Ltd. Shenzhen N/A CN
Assignee:	Shenzhen Soundsoul Information Technology Co. Ltd. (Shenzhen, CN)
Appl. No.:	D/513,360
Filed:	December 30, 2014

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Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/223,205,206 ;D24/174 ;181/129,130,135 ;379/430,431 ;381/380,381,370,371,374,375 ;455/90.3,575.1

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Schmeiser Olsen & Watts, LLP