Electronic component heatsink assembly
Lu , et al. December 5, 2
U.S. patent number D804,434 [Application Number D/568,075] was granted by the patent office on 2017-12-05 for electronic component heatsink assembly. This patent grant is currently assigned to ADDA CORP.. The grantee listed for this patent is ADDA CORP.. Invention is credited to Yung-Chang Chen, Sheng-Hsiung Lu.
| United States Patent | D804,434 |
| Lu , et al. | December 5, 2017 |
Electronic component heatsink assembly
Claims
CLAIM The ornamental design for an electronic component heatsink assembly, as shown and described.
| Inventors: | Lu; Sheng-Hsiung (Kaohsiung, TW), Chen; Yung-Chang (Kaoshiung, TW) | ||||||||||
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| Applicant: |
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| Assignee: | ADDA CORP. (Kaohsiung,
TW) |
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| Appl. No.: | D/568,075 | ||||||||||
| Filed: | June 15, 2016 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179,145,184 ;D23/318,322 |
References Cited [Referenced By]
U.S. Patent Documents
| 4853828 | August 1989 | Penn |
| 5999405 | December 1999 | Zappacosta |
| 6181561 | January 2001 | Albrecht |
| 6549410 | April 2003 | Cohen |
| 6976525 | December 2005 | Lin |
| 7144762 | December 2006 | So |
| 7172017 | February 2007 | Tan |
| D573110 | July 2008 | Otsuki |
| 7450400 | November 2008 | Boudreaux |
| D672728 | December 2012 | Lin |
| D672730 | December 2012 | Lin |
| D755740 | May 2016 | Chen |
| 9560792 | January 2017 | Ramones |
| 2005/0072558 | April 2005 | Whitney |
| 2007/0215335 | September 2007 | Chen |
| 2009/0194252 | August 2009 | Lee |
| 2010/0165580 | July 2010 | Li |
| 2016/0212880 | July 2016 | Wang |
| 2017/0034950 | February 2017 | Sung |
Other References
|
Alpha heatsinks, "Announcment of new push pin heat sink series", Posted Dec. 26, 2013, Accessed Jun. 29, 2017. (https://www.micforg.co.jp/en/nw130509e.html). cited by examiner . Frosty Tech, "Cooler Master Hyper Z600 Passive Heatsink Review Cooler Master Hyper Z600 Passive Heatsink Review", Posted May 8, 2008, Accessed Jun. 29, 2017. (http://www.frostytech.com/articleview.cfm?articleid=2273&page=1). cited by examiner. |
Primary Examiner: Rivard; Jennifer
Assistant Examiner: Rivas; April
Attorney, Agent or Firm: Jackson IPG PLLC Jackson; Demian K.
Description
FIG. 1 is a perspective view of an electronic component heatsink assembly showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines showing of an electronic component, fins and push pins in the drawings depict environmental subject matter only and form no part of the claimed design.
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References
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