U.S. patent application number 10/955279 was filed with the patent office on 2005-04-07 for heat sink assembly and connecting device.
This patent application is currently assigned to Aavid Thermalloy, LLC. Invention is credited to Kang, Sukhvinder Singh, Whitney, Bradley Robert.
Application Number | 20050072558 10/955279 |
Document ID | / |
Family ID | 34434914 |
Filed Date | 2005-04-07 |
United States Patent
Application |
20050072558 |
Kind Code |
A1 |
Whitney, Bradley Robert ; et
al. |
April 7, 2005 |
Heat sink assembly and connecting device
Abstract
A heat sink assembly includes a heat sink with a base plate
having a top surface with fins for dissipating heat and an opposed
bottom surface for placing against an electronic device mounted on
a printed circuit board, and at least one connecting device for
loading the heat sink against the electronic device. The connector
includes a mechanical fastener such as a push pin having an end
which engages the circuit board, a compression spring received
against a shoulder on the fastener, and a cup member which is
installed in an aperture in the base plate so that a floor of the
cup member provides a bearing surface for the spring which is below
the bottom surface of the base plate. An alternative connector
utilizes a conical spring received through the base plate and
receiving the fastener therein to load the spring in tension
against the electronic device.
Inventors: |
Whitney, Bradley Robert;
(Boscawen, NH) ; Kang, Sukhvinder Singh;
(Rochester, MN) |
Correspondence
Address: |
COHEN, PONTANI, LIEBERMAN & PAVANE
551 FIFTH AVENUE
SUITE 1210
NEW YORK
NY
10176
US
|
Assignee: |
Aavid Thermalloy, LLC
|
Family ID: |
34434914 |
Appl. No.: |
10/955279 |
Filed: |
September 30, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60508460 |
Oct 3, 2003 |
|
|
|
Current U.S.
Class: |
165/80.3 ;
257/E23.084 |
Current CPC
Class: |
H01L 23/4006 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/080.3 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. A heat sink assembly for connecting to an electronic device
mounted on a printed circuit board, said assembly comprising: a
heat sink comprising a base plate having a top surface and an
opposed bottom surface for placing against an electronic device; a
bearing surface which is fixed with respect to said heat sink; a
mechanical fastener having a first end, a second end for fixing
said fastener to a printed circuit board, a shank extending between
said first end and said second end, and a shoulder on said shank,
said shoulder facing said second end; and a spring having a first
portion received against said bearing surface and a second portion
received against said shoulder, one of said first and second
portions being located below said bottom surface of said base
plate, said spring loading said heat sink toward said printed
circuit board when said second end of said fastener is fixed to the
printed circuit board.
2. The assembly of claim 1 wherein said bearing surface is located
below said bottom surface of said base plate, said spring being a
compression spring which loads the first end of the fastener away
from said bearing surface.
3. The assembly of claim 2 wherein said spring is a coil spring
through which said shank passes, said coil spring having a first
end forming said first portion and a second end forming said second
portion.
4. The assembly of claim 3 further comprising a cup member having a
lip, a floor, and a wall extending between said lip and said floor,
said lip being positively positioned with respect to said base
plate, said floor forming said bearing surface and having a central
aperture through which said shank passes.
5. The assembly of claim 4 wherein said wall is substantially
cylindrical.
6. The assembly of claim 4 wherein said lip is formed by a flange
extending radially outward from said wall, said flange being
received against said top surface of said heat sink base plate,
said base plate having an aperture through which said wall
passes.
7. The assembly of claim 4 wherein said base plate comprises a
recess in said bottom surface, said lip being fixed in said
recess.
8. The assembly of claim 7 wherein said lip is fixed in said recess
by one of a press fit, threads, brazing, solder, and glue.
9. The assembly of claim 7 wherein said recess is countersunk
around an opening in said base plate, said head of said fastener
being received in said opening.
10. The assembly of claim 9 wherein said head of said fastener does
not extend above said top surface of said base plate, said opening
being constricyed to prevent passage of said head.
11. The assembly of claim 4 further comprising a retainer fitted to
said shank below said cup member, said retainer preventing
withdrawing of said fastener from said cup member prior to fixing
said second end of said fastener to said printed circuit board.
12. The assembly of claim 1 wherein said fastener is formed with a
head at said first end, said head forming said shoulder.
13. The assembly of claim 1 wherein said bearing surface is located
at said top surface of said base plate, said spring being a tension
spring which loads said shoulder toward said bearing surface.
14. The assembly of claim 13 wherein said spring is a coil spring
having a coil which forms said bearing surface.
15. The assembly of claim 14 wherein said coil spring is a
substantially conical spring.
16. A device for connecting a heat sink to an electronic device
mounted on a printed circuit board, said device comprising: a
mechanical fastener having a first end, a second end for fixing
said fastener to a printed circuit board, a shank extending between
said first end and said second end, and a shoulder on said shank,
said shoulder facing said second end; a cup member having a lip, a
floor, and a wall extending between said lip and said floor, said
floor forming a bearing surface and having a central aperture
through which said shank passes; and a compression spring having a
first portion received against said bearing surface and a second
portion received against said shoulder, said spring loading said
shoulder away from said bearing surface.
17. The device of claim 16 wherein said compression spring is a
coil spring having a first end forming said first portion and a
second end forming said second portion, said shank being received
through said coil spring.
18. The device of claim 16 wherein said lip is formed by a flange
extending radially outward from said wall.
19. The device of claim 16 further comprising a retainer fitted to
said shank below said cup member, said retainer preventing
withdrawing of said fastener from said cup member prior to fixing
said second end of said fastener to said printed circuit board.
20. The device of claim 16 wherein said fastener is formed with a
head at said first end, said head forming said shoulder.
Description
PRIORITY CLAIM
[0001] This application claims priority under 35 U.S.C. .sctn.119
from U.S. Provisional Application Ser. No. 60/508,460, filed Oct.
3, 2003.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to an assembly of a heat sink and a
connecting device for mounting to an electronic package on a
printed circuit board, wherein the connecting device includes a
fastener and a spring which loads the heat sink against the
electronic device when the fastener is attached to the printed
circuit board.
[0004] 2. Description of the Related Art
[0005] U.S. Pat. No. 5,384,940 discloses a heat sink assembly of
this type, wherein the heat sink has a top surface provided with
fins and a through hole which receives the shank of a "push pin"
fastener having a first end provided with a head, and a second end
provided with prongs which engage a hole in a printed circuit board
(PCB). A coil spring is provided around the shank between the
surface of the printed circuit board and a shoulder formed by the
head of the fastener. This spring is compressed when the second end
engages the PCB, thereby loading the heat sink against the
electronic device mounted on the PCB.
[0006] FIG. 1 shows a heat sink assembly of the prior art,
including a heat sink 10 and a connecting device 2, as mounted to
an electronic device 4 on a PCB 6. The heat sink 10 includes a base
plate 11 having a top surface 12 provided with fins 13, a bottom
surface 18, and an aperture 15 which is surrounded by a counter
bore. The connecting device 2 includes a fastener 20 having a first
end 21 provided with a head 22, a second end 24 received in a hole
7 in the PCB, a shank 28 extending between the ends 21, 24, and a
coil spring 40 received around the shank in the counter bore. The
fastener is retained to the heat sink by a C-clip 50 which engages
the shank below the base plate. The end 24 may be threaded for
retention in a threaded insert in the board.
[0007] Notwithstanding the use of a counter bore in the top
surface, the fastener and spring extend to a considerable height
above the surface. While this is not a problem where the cooling
fins are equally high, when the height of the heat sink is kept
short (under 0.3") due to taller components and tighter vertical
board spacing, there is no room for a typical push pin. The height
available after installation of the compressed spring and the head
of the push pin above the base plate is not sufficient to allow an
acceptable amount of deflection together with the necessary spring
force. This creates a need for a heat sink assembly including a
connecting device having sufficient deflection length to
accommodate variations in component size while providing the
necessary spring force for good thermal contact.
SUMMARY OF THE INVENTION
[0008] According to the invention, the spring has a first portion
which is received against a bearing surface fixed relative to the
circuit board, and a second portion received against a shoulder
formed on the fastener, wherein one of the first and second
portions is located below the bottom surface of the heat sink base
plate.
[0009] According to preferred embodiments, a cup member or thimble
having a floor is fixed in an aperture of the base plate so that
the floor provides a bearing surface below the bottom surface of
the base plate. The spring is a compression spring having a first
end which bears against the floor and a second end which bears
against a shoulder formed by the head of the fastener. The spring
therefore extends through the heat sink base thickness and below
the bottom surface of the heat sink, so that very little of the
fastener extends above the top surface of the base plate.
[0010] By placing most of the mounting hardware below the top
surface of the base plate, blockage of air flow to the cooling fins
is minimal. By allowing for taller hardware than could otherwise be
provided, the springs may be longer to provide the same force with
a lower spring rate, so that larger stack up tolerances can be
accommodated. Likewise, greater force may be applied using a longer
spring with the same spring rate.
[0011] According to one preferred embodiment, the lip of the cup
member is surrounded by a flange which is received against the top
surface of the base plate. The top surface of the base plate may be
countersunk around the aperture so that the flange is flush with or
below the top surface of the base plate. The cup member is
preferably drawn from sheet metal but may also be cast or molded of
other material.
[0012] According to another preferred embodiment, the lip is not
provided with a flange, and is press fit or otherwise fixed in the
aperture through the base plate. Preferably, a countersink is
provided in the bottom surface to limit travel of the cup member as
it is pressed upward, and to provide a bore of uniform diameter for
the spring. Alternatively, the cup member may be provided with an
annular shoulder which abuts the bottom surface of the plate to
limit travel. In every case the compression spring bears against a
bearing surface surrounding an aperture in the floor of the cup
member.
[0013] In a variation, the aperture is closed off at the top
surface but for a small hole located coaxially with the aperture.
This provides a pocket which contains the head of the fastener, so
that it cannot extend above the top surface of the base plate. In
this embodiment the length of the spring is limited, but the fins
may remain intact above the hole, access to the fastener head being
provided by locating the hole between two fins. Where the fastener
is a push pin, it is only necessary to push against the head of the
fastener to compress the spring until the prongs engage the PCB.
Where the fastener has screw threads at the second end, a turning
tool such as a hex key may be inserted in the hole.
[0014] In yet another embodiment, the cup member is eliminated and
a conical tension spring is used. A coil at the big end of the
spring bears against a bearing surface surrounding the aperture on
the top surface of the base plate, and a shoulder on the fastener
engages a coil located below the bottom surface of the base plate.
When the second end of the fastener engages the printed circuit
board, the heat sink is loaded against the electronic component by
tension in the spring. This embodiment offers the advantage of
fewer parts and lower cost.
[0015] Other objects and features of the present invention will
become apparent from the following detailed description considered
in conjunction with the accompanying drawings. It is to be
understood, however, that the drawings are designed solely for
purposes of illustration and not as a definition of the limits of
the invention, for which reference should be made to the appended
claims. It should be further understood that the drawings are not
necessarily drawn to scale and that, unless otherwise indicated,
they are merely intended to conceptually illustrate the structures
and procedures described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is an elevation view of a heat sink mounted with a
connecting device of the prior art;
[0017] FIG. 2A is an exploded perspective view of a heat sink and a
first embodiment of connecting device according to the present
invention;
[0018] FIG. 2B is an elevation view of a heat sink mounted with the
device of FIG. 2A;
[0019] FIG. 3A is an exploded perspective view of a heat sink and a
second embodiment of connecting device according to the
invention;
[0020] FIG. 3B is an elevation view of a heat sink mounted with the
device of FIG. 3A;
[0021] FIG. 4A is a perspective view of an alternative heat sink
and a third embodiment of heat sink according to the invention;
[0022] FIG. 4B is an elevation view of the alternative heat sink
mounted with the device of FIG. 4A; and
[0023] FIG. 5 is an elevation view of a heat sink mounted with a
fourth embodiment of connecting device according to the
invention.
DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS
[0024] FIGS. 2A and 2B show a first embodiment of connecting device
2 for fastening a heat sink 10 against an electronic device 4
mounted to a printed circuit board 6. The heat sink 10 includes a
base plate 11 having a top surface 12 provided with fins 13 which
are interrupted around a mounting aperture 15. The opposed bottom
surface 18 is received against the electronic device 4. The heat
sink is preferably made of aluminum, copper, graphite, or thermally
conductive plastic, and may be extruded, machined, cast, or
molded.
[0025] The connecting device 2 includes a mechanical fastener 20, a
cup member 30, and a spring 40. The mechanical fastener 20 has a
first end 21, a second end 24, and a shank 28 extending between
said ends. The first end 21 is provided with a head 22 which forms
a shoulder 23 facing the second end 25. The second end 24 is
provided with resilient mounting prongs 25 having barbs 26 which
engage the printed circuit board 6. The fastener may be made of
steel, brass, or aluminum, but may also be made of plastic where
electrical isolation is necessary. The fastener may be made by cold
heading, machining, casting, or injection molding.
[0026] The cup member 30 has a lip 32 surrounded by a flange 33, a
floor 34, and a cylindrical wall 37 extending between the lip and
the floor. The floor 34 forms a bearing surface 35 surrounding a
central aperture 36 which receives the shank 28. The flange 33
rests against the top surface 12 of the base plate 10 when the
cylindrical wall 37 is received in aperture 15 of the base plate
11. Where it is desired to minimize the height of the connector
above the top surface 12 of the base plate 11, a countersink may be
provided around the aperture 15 so that the flange 33 is flush with
the top surface. The cup member 30 may be made of metal or plastic,
if electrical isolation or specific corrosion resistance properties
are needed. The cup member 30 may be manufactured by sheet metal
stamping, drawing, metal spinning, cold heading, machining,
casting, or injection molding.
[0027] The spring 40 is a coil spring having a first end 42 which
is received against the bearing surface 35 on the floor 34 of the
cup member 30, and a second end 43 which is received against the
shoulder 23 formed by the head 22 of the fastener 20. The fastener
20 is dimensioned so that the spring 40 is compressed to load the
heat sink 10 toward the printed circuit board 6 when the prongs 25
engage a hole 7 in the printed circuit board. Fasteners are
preferably available in a variety of sizes so that heat sinks of
varying heights may be accommodated while maintaining the proper
spring force. The advantage of the invention may readily be seen in
FIG. 2B, where the first end of the fastener does not extend above
the top of the heat sink fins 13. A desired spring force is
therefore achieved without increasing the overall height of the
heat sink assembly, thereby improving the stacking tolerance of the
PCB's. The spring is typically made of metal with the desired
spring characteristic unless electrical isolation and/or specific
corrosion resistance requirements dictate otherwise, in which case
an elastomeric material could be used. The spring may be wire
formed, stamped, or molded.
[0028] Pre-assembly of the fastener 20, cup member 30, and spring
40 is achieved easily by pressing the fastener 20 through the
aperture in the floor of cup member 30, thereby compressing the
spring 40 until the barbs 26 engage the bottom of the cup member
30. The cup member 30 may then be seated in the aperture 15 of the
base plate 11, the base plate 11 may be assembled to the device 4
on a PCB 6, and the first end 21 of the fastener pressed down until
the second end 24 passes through the hole 7 in the PCB 6. This
fixing may be achieved mechanically, for example by the radially
resilient prongs 25, or by soldering, in which case it is not
necessary to provide prongs. The spring 40 loads the heat sink 10
against the electronic device 4 for efficient heat transfer and
heat dissipation.
[0029] FIGS. 3A and 3B show a second embodiment of the connecting
device 2, wherein the cup member 30 is not provided with a flange
around the lip 32. Rather, the bottom surface 18 of the heat sink
base plate 11 is provided with a countersink 19 around the aperture
15, and the lip 33 is fit into the countersink 19. Alternatively,
the cylindrical wall 37 of the cup member 30 may be provided with a
shoulder which limits travel in aperture 15 in the base plate 11.
The cup member 30 may be press fit, threaded, soldered, brazed,
glued, or otherwise attached to the bottom surface of the base
plate. The features of the fastener 20 and spring 40 are
essentially as described in conjunction with the embodiment of
FIGS. 2A and 2B. A retainer 50 in the form of a C-clip is provided
to hold the fastener 20, cup member 30, and spring 40 together as a
unit which may be pre-assembled to the heat sink 10 prior to
assembling to the PCB 6.
[0030] FIGS. 4A and 4B show a third embodiment of connecting device
which is substantially similar to the second embodiment, but
modified for use with an alternative printed circuit board 6 having
an aperture 15 which is substantially closed at the top surface 12.
Here the shank 28 and spring 40 are somewhat shorter than in the
connecting device used with the heat sink 10 of FIGS. 2A and 2B.
The first end 21 of the fastener is located in a pocket below the
top surface and accessible only via an access hole 16 located
centrally of the aperture 15. The advantage here, is that the heat
sink fins 13 need not be interrupted above the connector, which can
be accessed by a tool received between the fins 13. The fins may,
however, be provided with at least one notch 14 to provide
sufficient clearance for the tool, which may be a hex key.
[0031] FIG. 5 shows a fourth embodiment of connecting device which
utilizes a conical tension spring 45 with a first portion 47 formed
by a coil at the big end, and a second portion 48 formed by a coil
remote from the big end. The first portion 47 bears against a
bearing surface 17 on the top surface of the base plate 11
surrounding the aperture 15, and the second portion 48 bears
against a second shoulder 29 formed on the shank 28 remote from the
head 22. When the fastener 20 is pushed downward so that the second
end 24 engages the hole 7 in the PCB 6, the spring 45 is under
tension and thus loads the heat sink 10 against the electronic
device 4. This embodiment offers the advantages of a very low
profile with respect to the top surface 12 of the base plate 11,
and a reduction in the number of parts in the connector, insofar as
both the cup member and the retainer are eliminated.
[0032] Thus, while there have shown and described and pointed out
fundamental novel features of the invention as applied to a
preferred embodiment thereof, it will be understood that various
omissions and substitutions and changes in the form and details of
the devices illustrated, and in their operation, may be made by
those skilled in the art without departing from the spirit of the
invention. For example, it is expressly intended that all
combinations of those elements and/or method steps which perform
substantially the same function in substantially the same way to
achieve the same results are within the scope of the invention.
Moreover, it should be recognized that structures and/or elements
and/or method steps shown and/or described in connection with any
disclosed form or embodiment of the invention may be incorporated
in any other disclosed or described or suggested form or embodiment
as a general matter of design choice. It is the intention,
therefore, to be limited only as indicated by the scope of the
claims appended hereto.
* * * * *