Mold for packaging semiconductor light emitting device

Description

FIG. 1 is a perspective view of a mold for packaging semiconductor light emitting device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view thereof, taken generally along the line A-A' in FIG. 6; and,

FIG. 9 is a sectional view thereof, taken generally along the line B-B' in FIG. 6.

Claims

CLAIM The ornamental design for a mold for packaging semiconductor light emitting device, as shown and described.

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Inventors:	Kim; Kyoung Min (Gyeonggi-do, KR), Jeon; Soo Kun (Gyeonggi-do, KR), Park; Eun Hyun (Gyeonggi-do, KR)
Applicant:	Name City State Country Type SEMICON LIGHT CO., LTD. Gyeonggi-do N/A KR
Assignee:	SEMICON LIGHT CO., LTD. (Gyeonggi-Do, KR)
Appl. No.:	D/569,226
Filed:	June 24, 2016

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Foreign Application Priority Data

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Dec 24, 2015 [KR]			30-2015-0066133

Current U.S. Class:	D26/120
Current International Class:	2699
Field of Search:	;D26/1,24,120,138 ;D13/180

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References Cited [Referenced By]

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U.S. Patent Documents

D568833	May 2008	Li
D599750	September 2009	Kim
D622680	August 2010	Lin
D627310	November 2010	Lin
D627921	November 2010	Chen
D634284	March 2011	Ko
D634285	March 2011	Ko
8415692	April 2013	Toquin
8610140	December 2013	Joo et al.
D704358	May 2014	Joo
8748915	June 2014	Chan et al.
D761674	July 2016	Nikaido

Primary Examiner: Vinson; Brian N
Attorney, Agent or Firm: Harness, Dickey & Pierce, P.L.C.