U.S. patent number D793,400 [Application Number D/563,885] was granted by the patent office on 2017-08-01 for heat sink for memory module.
This patent grant is currently assigned to Kingston Digital, Inc.. The grantee listed for this patent is KINGSTON DIGITAL, INC.. Invention is credited to Peter Leekuo Chou, Yu-kuo Huang, Yi-Ting Lin, Tsung Shiao Tsai.
United States Patent |
D793,400 |
Lin , et al. |
August 1, 2017 |
Heat sink for memory module
Claims
CLAIM We claim the ornamental design for a heat sink for memory
module, as shown and described.
Inventors: |
Lin; Yi-Ting (Hsinchu,
TW), Huang; Yu-kuo (Hsinchu, TW), Chou;
Peter Leekuo (Fountain Valley, CA), Tsai; Tsung Shiao
(New Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
KINGSTON DIGITAL, INC. |
Fountain Valley |
CA |
US |
|
|
Assignee: |
Kingston Digital, Inc.
(Fountain Valley, CA)
|
Appl.
No.: |
D/563,885 |
Filed: |
May 9, 2016 |
Current U.S.
Class: |
D14/435; D13/179;
D14/436 |
Current International
Class: |
1402 |
Field of
Search: |
;D14/435,356,242,436,433,474,240,496,385,358,480.1-480.7
;360/97.01,685,686,752,737,732,784,803
;439/345,346,377,135,144,139-141,147,136,638,518,131 ;365/51,63,131
;710/52,300,313 ;711/115,103,154,161-162 ;70/58 ;323/210 ;713/186,1
;382/124 ;235/492 ;D13/179,147 ;165/80.1,80.2,80.3,185
;361/715,702,710,719,717,728,730,741,709,720,704,700,752,753,701,684,711,679.54,690,692
;257/707,706,708,709,719,711-713,715,718,E23.086,E23.103,E23.088,E23.098,E23.08,4,E23.102,E23.101,E23.105,E25.023 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lee; Susan Moon
Attorney, Agent or Firm: Skaar Ulbrich Macari, P.A.
Description
FIG. 1 is a perspective view of a heat sink for memory module
showing the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged fragment view of the portion of the heat sink
for memory module indicated by encircled region "A" of FIG. 2;
FIG. 10 is an enlarged fragment view of the portion of the heat
sink for memory module indicated by encircled region "B" of FIG.
2;
FIG. 11 is an exemplary perspective view showing the heat sink for
memory module in use; and,
FIG. 12 is another exemplary perspective view showing the heat sink
for memory module in use.
The broken lines in FIG. 2 are employed merely to indicate which
portions of the heat sink are shown in enlargement in FIGS. 9 and
10, and form no part of the claimed design.
The illustrative broken line showing of a card placed within the
heat sink in FIGS. 11 and 12 depicts an exemplary component which
might be used with the heat sink for memory module, and forms no
part of the claimed design.
* * * * *