Heat sink for memory module

Lin , et al. August 1, 2

Patent Grant D793400

U.S. patent number D793,400 [Application Number D/563,885] was granted by the patent office on 2017-08-01 for heat sink for memory module. This patent grant is currently assigned to Kingston Digital, Inc.. The grantee listed for this patent is KINGSTON DIGITAL, INC.. Invention is credited to Peter Leekuo Chou, Yu-kuo Huang, Yi-Ting Lin, Tsung Shiao Tsai.


United States Patent D793,400
Lin ,   et al. August 1, 2017

Heat sink for memory module

Claims

CLAIM We claim the ornamental design for a heat sink for memory module, as shown and described.
Inventors: Lin; Yi-Ting (Hsinchu, TW), Huang; Yu-kuo (Hsinchu, TW), Chou; Peter Leekuo (Fountain Valley, CA), Tsai; Tsung Shiao (New Taipei, TW)
Applicant:
Name City State Country Type

KINGSTON DIGITAL, INC.

Fountain Valley

CA

US
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Appl. No.: D/563,885
Filed: May 9, 2016

Current U.S. Class: D14/435; D13/179; D14/436
Current International Class: 1402
Field of Search: ;D14/435,356,242,436,433,474,240,496,385,358,480.1-480.7 ;360/97.01,685,686,752,737,732,784,803 ;439/345,346,377,135,144,139-141,147,136,638,518,131 ;365/51,63,131 ;710/52,300,313 ;711/115,103,154,161-162 ;70/58 ;323/210 ;713/186,1 ;382/124 ;235/492 ;D13/179,147 ;165/80.1,80.2,80.3,185 ;361/715,702,710,719,717,728,730,741,709,720,704,700,752,753,701,684,711,679.54,690,692 ;257/707,706,708,709,719,711-713,715,718,E23.086,E23.103,E23.088,E23.098,E23.08,4,E23.102,E23.101,E23.105,E25.023

References Cited [Referenced By]

U.S. Patent Documents
7738252 June 2010 Schuette
D657756 April 2012 Mueller
D689829 September 2013 Chen
D698792 February 2014 Lin
D702689 April 2014 Lin
D702690 April 2014 Lin
D733145 June 2015 Chen
D735201 July 2015 Lin
2006/0056154 March 2006 Foster, Sr.
2006/0268523 November 2006 Lin
2008/0101036 May 2008 Chen
2014/0367077 December 2014 Wu
Primary Examiner: Lee; Susan Moon
Attorney, Agent or Firm: Skaar Ulbrich Macari, P.A.

Description



FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged fragment view of the portion of the heat sink for memory module indicated by encircled region "A" of FIG. 2;

FIG. 10 is an enlarged fragment view of the portion of the heat sink for memory module indicated by encircled region "B" of FIG. 2;

FIG. 11 is an exemplary perspective view showing the heat sink for memory module in use; and,

FIG. 12 is another exemplary perspective view showing the heat sink for memory module in use.

The broken lines in FIG. 2 are employed merely to indicate which portions of the heat sink are shown in enlargement in FIGS. 9 and 10, and form no part of the claimed design.

The illustrative broken line showing of a card placed within the heat sink in FIGS. 11 and 12 depicts an exemplary component which might be used with the heat sink for memory module, and forms no part of the claimed design.

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