U.S. patent number D787,574 [Application Number D/566,474] was granted by the patent office on 2017-05-23 for 3d printer. This patent grant is currently assigned to KINPO ELECTRONICS, INC., XYZPRINTING, INC.. The grantee listed for this patent is KINPO ELECTRONICS, INC., XYZPRINTING, INC.. Invention is credited to Yi-Chu Hsieh, Chun-Hsiang Huang, Jia-Yi Juang, Yang-Teh Lee, Chun-Heng Ou, Kwei-Jui Teng, Pin-Hsuan Wu, Hong-Chuan Yeh.
United States Patent | D787,574 |
Lee , et al. | May 23, 2017 |
Inventors: | Lee; Yang-Teh (New Taipei, TW), Juang; Jia-Yi (New Taipei, TW), Huang; Chun-Hsiang (New Taipei, TW), Ou; Chun-Heng (New Taipei, TW), Teng; Kwei-Jui (New Taipei, TW), Hsieh; Yi-Chu (New Taipei, TW), Wu; Pin-Hsuan (New Taipei, TW), Yeh; Hong-Chuan (New Taipei, TW) | ||||||||||
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Applicant: |
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Assignee: | XYZPRINTING, INC. (New Taipei,
TW) KINPO ELECTRONICS, INC. (New Taipei, TW) |
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Appl. No.: | D/566,474 | ||||||||||
Filed: | May 31, 2016 |
Current U.S. Class: | D15/122 |
Current International Class: | 1509 |
Field of Search: | ;D14/420-425 ;D18/14,19,36-39,50,53,54,54.1,55 ;D15/122,135 |
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D742439 | November 2015 | Kraibuhler |
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