U.S. patent number D734,814 [Application Number D/465,027] was granted by the patent office on 2015-07-21 for 3d printer. This patent grant is currently assigned to Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc., XYZprinting, Inc.. The grantee listed for this patent is Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc., XYZprinting, Inc.. Invention is credited to Chien-Chih Chen, Ming-En Ho, Chi-Wen Hsieh, Kwei-Jui Teng, Hong-Chuan Yeh.
United States Patent | D734,814 |
Yeh , et al. | July 21, 2015 |
Inventors: | Yeh; Hong-Chuan (New Taipei, TW), Ho; Ming-En (New Taipei, TW), Chen; Chien-Chih (New Taipei, TW), Hsieh; Chi-Wen (New Taipei, TW), Teng; Kwei-Jui (New Taipei, TW) | ||||||||||
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Applicant: |
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Assignee: | XYZprinting, Inc. (New Taipei,
TW) Kinpo Electronics, Inc. (New Taipei, TW) Cal-Comp Electronics & Communications Company Limited (New Taipei, TW) |
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Appl. No.: | D/465,027 | ||||||||||
Filed: | August 23, 2013 |
Current U.S. Class: | D18/50 |
Current International Class: | 1802 |
Field of Search: | ;D18/36-37,50,54,54.1,55 ;D14/420-425,462-470 ;400/613,613.1-613.4,690.1-690.4,691-694 ;264/113,308 ;425/143,375 |
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