Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line in the figure drawings is included for the purpose of illustrating environment and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a semiconductor device, as shown and described.

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Inventors:	Yoneyama; Rei (Tokyo, JP), Araki; Takehiro (Fukuoka, JP), Kimura; Yoshitaka (Tokyo, JP), Goto; Akira (Fukuoka, JP), Yamashita; Akihiko (Hyogo, JP), Ono; Mariko (Fukuoka, JP), Goto; Ryo (Tokyo, JP)
Applicant:	Name City State Country Type Mitsubishi Electric Corporation Tokyo N/A JP
Assignee:	Mitsubishi Electric Corporation (Tokyo, JP)
Appl. No.:	D/530,661
Filed:	June 18, 2015

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Foreign Application Priority Data

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Feb 4, 2015 [JP]			2015-002064

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/133,147,154,182,184,199

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References Cited [Referenced By]

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U.S. Patent Documents

D357462	April 1995	Terasawa
D401912	December 1998	Majumdar
D705184	May 2014	Takahashi
D767516	September 2016	Yoneyama
D773413	December 2016	Yoneyama
2010/0149774	June 2010	Matsumoto

Primary Examiner: Bui; Daniel
Attorney, Agent or Firm: Studebaker & Brackett PC