Electronic device cover

Description

FIG. 1 is a first perspective view of a first embodiment of an electronic device cover in a first position, taken from above;

FIG. 2 is a second perspective view of the first embodiment of the electronic device cover of FIG. 1, taken from below;

FIG. 3 is a front view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 4 is a back view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 5 is a right-side view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 6 is a left-side view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 7 is a bottom view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 8 is a top view of the first embodiment of the electronic device cover of FIG. 1;

FIG. 9 is a first perspective view of a second embodiment of an electronic device cover in a first position, taken from above;

FIG. 10 is a second perspective view of the second embodiment of the electronic device cover of FIG. 9, taken from below;

FIG. 11 is a front view of the second embodiment of the electronic device cover of FIG. 9;

FIG. 12 is a back view of the second embodiment of the electronic device cover of FIG. 9;

FIG. 13 is a right-side view of the second embodiment of the electronic device cover of FIG. 9;

FIG. 14 is a left-side view of the second embodiment of the electronic device cover of FIG. 9;

FIG. 15 is a bottom view of the second embodiment of the electronic device cover of FIG. 9; and,

FIG. 16 is a top view of the second embodiment of the electronic device cover of FIG. 9.

The broken lines showing portions of the electronic device cover form no part of the claimed design.

Claims

CLAIM The ornamental design for an electronic device cover, as shown and described.

---

Inventors:	Mecchella; Monica Liane (San Francisco, CA), Moore; Jesse Wheeler (Oakland, CA), Green; Christopher (San Francisco, CA)
Applicant:	Name City State Country Type Amazon Technologies, Inc. Seattle WA US
Assignee:	Amazon Technologies, Inc. (Seattle, WA)
Appl. No.:	D/535,999
Filed:	August 12, 2015

---

Current U.S. Class:	D14/440
Current International Class:	1402
Field of Search:	;D14/250,440,447 ;206/45.23,320,45.2 ;361/679.55 ;294/25 ;224/218

---

References Cited [Referenced By]

---

U.S. Patent Documents

D546878	July 2007	Bharma
D624304	September 2010	Danze
D628374	December 2010	Lee
D641348	July 2011	Kim
D652829	January 2012	Kim
D654069	February 2012	Kwon
D657354	April 2012	Kim
D659139	May 2012	Gengler
D669480	October 2012	Piedra
D674800	January 2013	Kim
D702673	April 2014	Murchison
D712393	September 2014	Kim
D723038	February 2015	Kim
D727331	April 2015	Curran-Blaney
D733111	June 2015	Kim
D733694	July 2015	Kim
D741309	October 2015	Kim
D744493	December 2015	Kim
D745525	December 2015	Bates
D748634	February 2016	Hofer
D750086	February 2016	Langhein
2011/0290687	December 2011	Han
2013/0015088	January 2013	Wu
2013/0214661	August 2013	McBroom
2013/0264459	October 2013	McCosh

Other References

Korean Office Action mailed Jul. 13, 2016 for Korean Design Application No. 30-2016-5883 M001, a counterpart foreign application of Design U.S. Appl. No. 29/535,999, 2 pages. cited by applicant . Korean Office Action mailed Jul. 13, 2016 for Korean Design Application No. 30-2016-5883 M002, a counterpart foreign application of Design U.S. Appl. No. 29/535,999. cited by applicant . Canadian Office Action mailed Jun. 10, 2016 for Canadian Design Application No. 166791, a counterpart foreign design application of Design U.S. Appl. No. 29/535,999, 2 pages. cited by applicant . Indian Office Action mailed May 27, 2016 for Indian design application No. 280179, a counterpart foreign design application of design U.S. Appl. No. 29/535,999, 10 pages. cited by applicant . Translated Japanese Office Action mailed Aug. 12, 2016 for Japanese design application No. 2016-002666, a counterpart foreign application of design U.S. Appl. No. 29/535,999, 4 pages. cited by applicant.

Primary Examiner: Underwood; Cynthia
Attorney, Agent or Firm: Lee & Hayes, PLLC