Electronic device case with flip cover
Kim , et al. September 2, 2
U.S. patent number D712,393 [Application Number D/467,385] was granted by the patent office on 2014-09-02 for electronic device case with flip cover. This patent grant is currently assigned to BlackBerry Limited. The grantee listed for this patent is BlackBerry Limited. Invention is credited to Caitlin Curran-Blaney, Younghwan Kim, Alison Phillips.
| United States Patent | D712,393 |
| Kim , et al. | September 2, 2014 |
Electronic device case with flip cover
Claims
CLAIM The ornamental design for an electronic device case with flip cover, as shown and described.
| Inventors: | Kim; Younghwan (Waterloo, CA), Curran-Blaney; Caitlin (Toronto, CA), Phillips; Alison (Toronto, CA) | ||||||||||
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| Applicant: |
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| Assignee: | BlackBerry Limited (Waterloo,
Ontario, CA) |
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| Appl. No.: | D/467,385 | ||||||||||
| Filed: | September 18, 2013 |
| Current U.S. Class: | D14/250 |
| Current International Class: | 1403 |
| Field of Search: | ;D14/250-253,440,203.3-203.7,217,496,248,238.1,240,447,341-347,444 ;D13/103,107-108,119 ;D3/201,218,247,269,273,301,303 ;248/176.3,188.8,309.1,371,668 ;361/220,379.01,679.01,679.02,679.09,679.21,679.25,679.3,679.4,679.56,679.57,759,807,816 ;379/433.11,451,455 ;455/556.1,557,566,575.1,575.2,575.8 ;206/37,45.2,305,320,216 ;320/108,115 ;429/96 ;220/4.02 ;150/165 ;174/50 ;235/41,375,462 ;312/223.1 ;396/535 |
References Cited [Referenced By]
U.S. Patent Documents
| 6599657 | July 2003 | Pollett et al. |
| D582405 | December 2008 | Andre et al. |
| D621396 | August 2010 | Lee et al. |
| D641348 | July 2011 | Kim et al. |
| D652829 | January 2012 | Kim et al. |
| D657354 | April 2012 | Kim |
| 8230992 | July 2012 | Law et al. |
| D669270 | October 2012 | Phillips et al. |
| D674799 | January 2013 | Kim |
| D674800 | January 2013 | Kim |
| D678260 | March 2013 | Bau |
| D684978 | June 2013 | Phillips et al. |
| D685799 | July 2013 | Canizares et al. |
| D685800 | July 2013 | Canizares et al. |
| D685801 | July 2013 | Canizares et al. |
| D685802 | July 2013 | Canizares et al. |
| 8479915 | July 2013 | Chen |
| D688251 | August 2013 | Akana et al. |
| D702673 | April 2014 | Murchison et al. |
| 2002/0080567 | June 2002 | Bone et al. |
| 2003/0150756 | August 2003 | Kajiya |
| 2011/0290687 | December 2011 | Han |
| 2012/0244920 | September 2012 | Lee |
| 2013/0015088 | January 2013 | Wu |
Description
FIG. 1 is a front perspective view of an electronic device case with flip cover;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Broken lines shown in the drawings illustrate environment that forms no part of the claimed design. The stippling and linear shading show contrast between surfaces.
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