Earphone
Son November 1, 2
U.S. patent number D770,412 [Application Number D/531,665] was granted by the patent office on 2016-11-01 for earphone. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Hyun-Keun Son.
| United States Patent | D770,412 |
| Son | November 1, 2016 |
Earphone
Claims
CLAIM I claim the ornamental design for an earphone, as shown and described.
| Inventors: | Son; Hyun-Keun (Seoul, KR) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Applicant: |
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| Assignee: | Samsung Electronics Co., Ltd.
(Suwon-si, KR) |
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| Appl. No.: | D/531,665 | ||||||||||
| Filed: | June 29, 2015 |
Foreign Application Priority Data
| Dec 29, 2014 [KR] | 30-2014-0063750 | |||
| Current U.S. Class: | D14/205; D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,223 ;D24/106,174 ;181/129,130,135,106 ;379/430,431,420.02,420.03 ;381/380,381,373,328,323,321 ;128/864,865,868 ;600/25 ;455/90.3,575.1,569.1 |
References Cited [Referenced By]
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Attorney, Agent or Firm: NSIP Law
Description
FIG. 1 is a front perspective view of an earphone showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a front perspective view in which a cord is provided in broken lines to illustrate an example environment.
The broken lines in the figures show portions of the earphone which form no part of the claimed design.
The jagged uneven broken lines indicate an omission boundary and form no part of the claimed design.
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