Overlay for electronic device

Beaupre , et al. September 27, 2

Patent Grant D767550

U.S. patent number D767,550 [Application Number D/480,546] was granted by the patent office on 2016-09-27 for overlay for electronic device. This patent grant is currently assigned to Belkin International, Inc.. The grantee listed for this patent is Belkin International, Inc.. Invention is credited to Eric Beaupre, John F. Wadsworth.


United States Patent D767,550
Beaupre ,   et al. September 27, 2016

Overlay for electronic device

Claims

CLAIM We claim the ornamental design for the overlay for electronic device, substantially as shown and described.
Inventors: Beaupre; Eric (Los Angeles, CA), Wadsworth; John F. (Burbank, CA)
Applicant:
Name City State Country Type

Belkin International, Inc.

Playa Vista

CA

US
Assignee: Belkin International, Inc. (Playa Vista, CA)
Appl. No.: D/480,546
Filed: January 27, 2014

Current U.S. Class: D14/250
Current International Class: 1403
Field of Search: ;D14/250-253,440,203.3-203.7,217,496,248,238.1,240,447,230,247,341,345,346,439 ;D3/201,218,269,301,273,303 ;D13/103,107-108 ;220/4.02 ;248/309.1 ;361/679.56 ;379/426,433.11,455 ;455/575.1,575.8 ;190/100 ;206/305,320

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Primary Examiner: Snapp; Sandra
Assistant Examiner: Thurman; Holly E
Attorney, Agent or Firm: Bryan Cave LLP

Description



FIG. 1 is a top perspective view of an overlay for electronic device, according to a first embodiment;

FIG. 2 is a bottom perspective view of the overlay for electronic device, according to the first embodiment;

FIG. 3 is a top plan view of the overlay for electronic device, according to the first embodiment;

FIG. 4 is a side elevational view of the overlay for electronic device, according to the first embodiment, where the opposite side elevational view is a mirror image thereof;

FIG. 5 is a bottom plan view of the overlay for electronic device, according to the first embodiment;

FIG. 6 is a top plan view of the overlay for electronic device in a folded configuration, according to the first embodiment;

FIG. 7 is a top perspective view of an overlay for electronic device, according to a second embodiment;

FIG. 8 is a bottom perspective view of the overlay for electronic device, according to the second embodiment;

FIG. 9 is a top plan view of the overlay for electronic device, according to the second embodiment;

FIG. 10 is a side elevational view of the overlay for electronic device, according to the second embodiment, where the opposite side elevational view is a mirror image thereof;

FIG. 11 is a bottom plan view of the overlay for electronic device, according to the second embodiment; and,

FIG. 12 is a top plan view of the overlay for electronic device in a folded configuration, according to the second embodiment.

* * * * *

References


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