Triangular semiconductor die
Sharma , et al. August 16, 2
U.S. patent number D763,806 [Application Number D/456,727] was granted by the patent office on 2016-08-16 for triangular semiconductor die. This patent grant is currently assigned to Soraa, Inc.. The grantee listed for this patent is SORAA, INC.. Invention is credited to Andrew Felker, Rajat Sharma.
| United States Patent | D763,806 |
| Sharma , et al. | August 16, 2016 |
Triangular semiconductor die
Claims
CLAIM The ornamental design for triangular semiconductor die, as shown and described.
| Inventors: | Sharma; Rajat (Fremont, CA), Felker; Andrew (Fremont, CA) | ||||||||||
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| Applicant: |
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| Assignee: | Soraa, Inc. (Fremont,
CA) |
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| Appl. No.: | D/456,727 | ||||||||||
| Filed: | June 3, 2013 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29439581 | Dec 12, 2012 | D720310 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/110,182 ;257/668,678,690 ;361/679.01,713,728,736,760,761,775,820 ;324/71.5,252 ;174/250,253 ;438/64,65,66 |
References Cited [Referenced By]
U.S. Patent Documents
| 3357544 | December 1967 | Gingher |
| 3390502 | July 1968 | Carroll |
| D233898 | December 1974 | Warren |
| D330325 | October 1992 | Kocon |
| D356033 | March 1995 | Horvat |
| D356705 | March 1995 | Aston |
| D411261 | June 1999 | Movsesian |
| D421806 | March 2000 | Graf |
| D438858 | March 2001 | del Castillo |
| D441730 | May 2001 | Oba |
| D467934 | December 2002 | Smyth |
| D473199 | April 2003 | Sako |
| D480371 | October 2003 | Sako |
| D516670 | March 2006 | Aselton |
| D537048 | February 2007 | Mitsui |
| D543160 | May 2007 | Mitsui |
| D568839 | May 2008 | Mitsui |
| D635622 | April 2011 | Martin |
| D688736 | August 2013 | Lilly |
Attorney, Agent or Firm: Saul Ewing LLP
Description
FIG. 1 is a perspective view of a triangular semiconductor die showing our new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevation view thereof;
FIG. 6 is another side elevation view thereof;
FIG. 7 is another side elevation view thereof; and,
FIG. 8 is another side elevation view thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
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