U.S. patent number D757,132 [Application Number D/517,175] was granted by the patent office on 2016-05-24 for 3d printer. This patent grant is currently assigned to Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc., XYZprinting, Inc.. The grantee listed for this patent is Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc., XYZprinting, Inc.. Invention is credited to Che-Wei Chang, Li-Wei Chen, Chieh Kao, Yu-Hao Lin, Hua Liu.
United States Patent | D757,132 |
Liu , et al. | May 24, 2016 |
Inventors: | Liu; Hua (New Taipei, TW), Kao; Chieh (New Taipei, TW), Chen; Li-Wei (New Taipei, TW), Lin; Yu-Hao (New Taipei, TW), Chang; Che-Wei (New Taipei, TW) | ||||||||||
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Applicant: |
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Assignee: | XYZprinting, Inc. (New Taipei,
TW) Kinpo Electronics, Inc. (New Taipei, TW) Cal-Comp Electronics & Communications Company Limited (New Taipei, TW) |
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Appl. No.: | D/517,175 | ||||||||||
Filed: | February 11, 2015 |
Jan 4, 2015 [CN] | 2015 3 0000877 | |||
Current U.S. Class: | D15/122; D15/135 |
Current International Class: | 1509 |
Field of Search: | ;D14/301,303 ;D15/122,135 ;D18/36-39,46-49,50,53,55,56,59 |
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