Headphones
Mackiewicz , et al. November 17, 2
U.S. patent number D743,369 [Application Number D/482,181] was granted by the patent office on 2015-11-17 for headphones. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Damian Mackiewicz, Chak Fai To, Ron.
| United States Patent | D743,369 |
| Mackiewicz , et al. | November 17, 2015 |
Headphones
Claims
CLAIM The ornamental design for headphones, as shown and described.
| Inventors: | Mackiewicz; Damian (Shenzen, CN), To, Ron; Chak Fai (Hong Kong, HK) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Applicant: |
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| Assignee: | Harman International Industries,
Incorporated (Northridge, CA) |
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| Appl. No.: | D/482,181 | ||||||||||
| Filed: | February 14, 2014 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29466046 | Sep 4, 2013 | ||||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205 ;181/129,130,135 ;379/430,431 ;381/380,381,374 ;455/90.3,575.1 |
References Cited [Referenced By]
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| D538261 | March 2007 | Taylor et al. |
| D576604 | September 2008 | Suzuki |
| D588100 | March 2009 | Densho et al. |
| D633895 | March 2011 | Morimoto |
| D666579 | September 2012 | Hou |
| D685771 | July 2013 | Bertenthal |
| D688648 | August 2013 | Li et al. |
| D688649 | August 2013 | Combs et al. |
| D691583 | October 2013 | Kitayama |
| D697048 | January 2014 | Pavitsich |
| D697495 | January 2014 | Lian |
| D713374 | September 2014 | Farrage |
| 2010/0046781 | February 2010 | Chen |
| 2012/0077556 | March 2012 | McKendrick |
| 2014/0079275 | March 2014 | Minarik et al. |
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is a perspective view of headphones showing our new design;
FIG. 2 is another perspective view thereof shown from an interior viewpoint;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a side elevational view thereof; and,
FIG. 6 is a bottom plan view thereof.
The broken line showings form no part of the claimed design.
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