Polishing pad for substrate polishing apparatus

Kinoshita , et al. June 9, 2

Patent Grant D731448

U.S. patent number D731,448 [Application Number D/489,180] was granted by the patent office on 2015-06-09 for polishing pad for substrate polishing apparatus. This patent grant is currently assigned to EBARA CORPORATION. The grantee listed for this patent is EBARA CORPORATION. Invention is credited to Toshifumi Kimba, Masaki Kinoshita.


United States Patent D731,448
Kinoshita ,   et al. June 9, 2015

Polishing pad for substrate polishing apparatus

Claims

CLAIM The ornamental design for a polishing pad for substrate polishing apparatus, as shown and described.
Inventors: Kinoshita; Masaki (Tokyo, JP), Kimba; Toshifumi (Tokyo, JP)
Applicant:
Name City State Country Type

EBARA CORPORATION

Tokyo

N/A

JP
Assignee: EBARA CORPORATION (Tokyo, JP)
Appl. No.: D/489,180
Filed: April 28, 2014

Foreign Application Priority Data

Oct 29, 2013 [JP] 2013-025148
Oct 29, 2013 [JP] 2013-025149
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;257/E21.001,E21.002,E21.21,E21.23 ;361/230,233,234 ;451/64,65,66,67,72,259,278,285,286,287,288,290

References Cited [Referenced By]

U.S. Patent Documents
5284659 February 1994 Cherukuri et al.
5431918 July 1995 Ferrero et al.
7109068 September 2006 Akram et al.
D560810 January 2008 Hennessy
7572173 August 2009 Huang et al.
7799618 September 2010 Kawase et al.
D649126 November 2011 Takahashi
D684551 June 2013 Nguyen
D702655 April 2014 Kimura
2002/0160693 October 2002 Nihonmatsu et al.
2005/0095963 May 2005 Stark et al.
2006/0079160 April 2006 Balagani et al.
2012/0164917 June 2012 Kobata et al.
Foreign Patent Documents
1334824 May 2008 JP
1396602 May 2013 TW
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Pearne & Gordon LLP

Description



FIG. 1 is a top plan view of a first embodiment of a polishing pad for substrate polishing apparatus, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front view thereof, the rear view being identical;

FIG. 4 is a right side view thereof, the left side view being identical;

FIG. 5 is an enlarged, top plan view thereof, taken along lines 5-5 of FIG. 1;

FIG. 6 is an enlarged, cross-sectional view thereof, taken along lines 6-6 of FIG. 5;

FIG. 7 is a top plan view of a second embodiment of a polishing pad for substrate polishing apparatus, showing our new design;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front view thereof, the rear view being identical;

FIG. 10 is a right side view thereof, the left view being identical;

FIG. 11 is an enlarged, partial top plan view thereof, taken along lines 11-11 of FIG. 7; and,

FIG. 12 is an enlarged, cross-sectional view thereof, taken along lines 12-12 of FIG. 11.

The dashed-dot-dashed lines represent the boundary lines of the claimed design. The even dashed broken lines depict environment subject matter only and form no part of the claimed design.

* * * * *


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