Housing for electronic modules with cooling fins

Description

FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.

FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.

FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,

FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.

The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.

Claims

CLAIM The ornamental design for a housing for electronic modules with cooling fins, as shown and described.

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Inventors:	Zimmer; Martin (Tettnang, DE)
Applicant:	Name City State Country Type Liebherr-Elektronik GmbH Lindau N/A DE
Assignee:	Liebherr-Elektronik GmbH (Lindau, DE)
Appl. No.:	D/478,926
Filed:	January 9, 2014

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Foreign Application Priority Data

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Jul 12, 2013 [EP]			2 273 391

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.26,104.33,122,151,185 ;257/706,707,718-722 ;361/695,697,700,702,704,709,710,711,719

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References Cited [Referenced By]

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U.S. Patent Documents

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D627316	November 2010	Theisen et al.
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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Alleman Hall McCoy Russell & Tuttle LLP