Heat sink for electronic equipment

Cook , et al. December 2, 2

Patent Grant D483019

U.S. patent number D483,019 [Application Number D/172,402] was granted by the patent office on 2003-12-02 for heat sink for electronic equipment. This patent grant is currently assigned to Vanner, Inc.. Invention is credited to Alexander Cook, David W. Douglas, Frank A. Leyshon, Michael E. O'Sullivan, Stephen D. Speck, David A. Watson.


United States Patent D483,019
Cook ,   et al. December 2, 2003

Heat sink for electronic equipment

Claims

The ornamental design for a heat sink for electronic equipment, as shown and described.
Inventors: Cook; Alexander (Dublin, OH), Speck; Stephen D. (Pataskala, OH), O'Sullivan; Michael E. (Canal Winchester, OH), Douglas; David W. (Cardington, OH), Leyshon; Frank A. (Cambridge, OH), Watson; David A. (New Concord, OH)
Assignee: Vanner, Inc. (Hilliard, OH)
Appl. No.: D/172,402
Filed: December 10, 2002

Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;165/80.3,104.14,104.33,121,122,180,185 ;174/16.3,52.4 ;206/713,714,715,716,727,728 ;257/706,707,718,719,720,721,722,727,686 ;361/271,274.3,697,702,704,709,710,711

References Cited [Referenced By]

U.S. Patent Documents
3209062 September 1965 Scholz
D403666 January 1999 Maack et al.
6206087 March 2001 Nakase et al.
D449587 October 2001 Cronin
6341644 January 2002 Lo et al.
6397941 June 2002 McCullough
6487078 November 2002 Kledzik et al.
6515862 February 2003 Wong et al.
Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Eley, Esq.; James R. Forhan, Esq.; Michael A. Thompson Hine LLP

Description



FIG. 1 is an isometric view of the heat sink for electronic equipment;

FIG. 2 is a left-side elevational view of the heat sink for electronic equipment;

FIG. 3 is a right-side elevational view of the heat sink for electronic equipment;

FIG. 4 is an elevational view of the aft end of the heat sink for electronic equipment;

FIG. 5 is an elevational view of the forward end of the heat sink for electronic equipment; and,

FIG. 6 is a top plan view of the heat sink for electronic equipment.

The bottom of the heat sink forms no part of the claimed design.

* * * * *


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