LED package

Lowes , et al. August 26, 2

Patent Grant D711840

U.S. patent number D711,840 [Application Number D/424,353] was granted by the patent office on 2014-08-26 for led package. This patent grant is currently assigned to Cree, Inc.. The grantee listed for this patent is Hormoz Benjamin, John A. Edmond, Sten Heikman, Bernd Keller, Theodore Lowes, Jesse Reiherzer, Eric J. Tarsa. Invention is credited to Hormoz Benjamin, John A. Edmond, Sten Heikman, Bernd Keller, Theodore Lowes, Jesse Reiherzer, Eric J. Tarsa.


United States Patent D711,840
Lowes ,   et al. August 26, 2014

LED package

Claims

CLAIM The ornamental design for an LED package, as shown and described herein.
Inventors: Lowes; Theodore (Lompoc, CA), Tarsa; Eric J. (Goleta, CA), Heikman; Sten (Goleta, CA), Keller; Bernd (Santa Barbara, CA), Edmond; John A. (Durham, NC), Reiherzer; Jesse (Raleigh, NC), Benjamin; Hormoz (Moorpark, CA)
Applicant:
Name City State Country Type

Lowes; Theodore
Tarsa; Eric J.
Heikman; Sten
Keller; Bernd
Edmond; John A.
Reiherzer; Jesse
Benjamin; Hormoz

Lompoc
Goleta
Goleta
Santa Barbara
Durham
Raleigh
Moorpark

CA
CA
CA
CA
NC
NC
CA

US
US
US
US
US
US
US
Assignee: Cree, Inc. (Durham, NC)
Appl. No.: D/424,353
Filed: June 11, 2012

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/1 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

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Other References

Letter of Examination Report from Taiwanese Patent appl. No. 101307391, dated Jun. 5, 2013. cited by applicant .
Cree.RTM. XLamp.RTM. MC-E LEDs Product Info Sheets, 14 pages. cited by applicant .
Nichia Corporation LEDs, Models NSSM016G, NSSM227, NESM026X, NSSM026BB, NESM005A, 9 pages. cited by applicant .
U.S. Appl. No. 29/412,854, filed Mar. 2012, Leung, et al. cited by applicant .
Reasons for Rejection from Japanese Design Patent Appl. No. 2013-004502, dated Aug. 6, 2013. cited by applicant .
Examination Report from Taiwanese Patent Appl. No. 102301478, dated Sep. 6, 2013. cited by applicant .
Design of Registration Notice from Japanese Patent Appl. No. 2012-030304, dated Jan. 21, 2014. cited by applicant .
First Office Action from Chinese Patent Appl. No. 201330052393.7, dated Jan. 9, 2014. cited by applicant .
Notice to Submit a Response from Korean Patent Appl. No. 30-2012-0059744, dated Nov. 26, 2013. cited by applicant .
Notice of Allowance and Search Report for Taiwanese Patent Appl. No. 101307391, dated Oct. 15, 2013. cited by applicant .
Notice to Submit a Response from Korean Design Appl. No. 30-2012-0059744 dated Apr. 28. 2014. cited by applicant.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Koppel, Patrick, Heybl & Philpott

Description



FIG. 1 is a top perspective view of an LED package according to one embodiment of the present invention.

FIG. 2 is a bottom perspective view of the LED package shown in FIG. 1.

FIG. 3 is a right elevation view of the LED package shown in FIG. 1.

FIG. 4 is a left elevation view of the LED package shown in FIG. 1.

FIG. 5 is a top view of the LED package shown in FIG. 1.

FIG. 6 is a bottom view of the LED package shown in FIG. 1.

FIG. 7 is a front elevation view of the LED package shown in FIG. 1; and,

FIG. 8 is a back elevation view of the LED package shown in FIG. 1.

The broken lines shown in the above figures depict environmental subject matter only and form no part of the claimed design in those embodiments.

* * * * *


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