LED package

Leung April 3, 2

Patent Grant D656906

U.S. patent number D656,906 [Application Number D/380,636] was granted by the patent office on 2012-04-03 for led package. This patent grant is currently assigned to Cree Hong Kong Limited. Invention is credited to Chi-Wing Leung.


United States Patent D656,906
Leung April 3, 2012

LED package

Claims

CLAIM The ornamental design for an LED package, as shown and described.
Inventors: Leung; Chi-Wing (Hong Kong, CN)
Assignee: Cree Hong Kong Limited (Hong Kong Science Park, HK)
Appl. No.: D/380,636
Filed: December 8, 2010

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29294459 Jan 10, 2008 D634863

Current U.S. Class: D13/180; D26/1
Current International Class: 1303
Field of Search: ;D26/1-4 ;313/313,315,316,317,318,493 ;315/52,53,56,57,58

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Primary Examiner: Jackson; Marcus
Attorney, Agent or Firm: Koppel, Patrick, Heybl & Philpott

Description



FIG. 1 is a perspective view of one embodiment of an LED package showing my design;

FIG. 2 is a top plan view of the LED package shown in FIG. 1;

FIG. 3 is a bottom plan view of the LED package shown in FIG. 1;

FIG. 4 is a front elevation view of the LED package shown in FIG. 1, with the back and both side elevation views being substantially similar;

FIG. 5 is a perspective view of another embodiment of an LED package showing my design;

FIG. 6 is a top plan view of the LED package shown in FIG. 5;

FIG. 7 is a bottom plan view of the LED package shown in FIG. 5;

FIG. 8 is a front elevation view of the LED package shown in FIG. 5, with the back and both side elevation views being substantially similar;

FIG. 9 is a perspective view of another embodiment of an LED package showing my design;

FIG. 10 is a top plan view of the LED package shown in FIG. 9;

FIG. 11 is a bottom plan view of the LED package shown in FIG. 9;

FIG. 12 is a front elevation view of the LED package shown in FIG. 9, with the back and both side elevation views being substantially similar;

FIG. 13 is a top plan view of one component of the LED package shown in FIG. 9;

FIG. 14 is a bottom plan view of one component of the LED package shown in FIG. 9;

FIG. 15 is a perspective view of another embodiment of an LED package showing my design;

FIG. 16 is a top plan view of the LED package shown in FIG. 15;

FIG. 17 is a bottom plan view of the LED package shown in FIG. 15; and,

FIG. 18 is a front elevation view of the LED package shown in FIG. 15, with the back and both side elevation views being substantially similar.

The broken lines in any of FIGS. 1-18 are for illustrative purposes only and form no part of the claimed design.

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