U.S. patent number D703,160 [Application Number D/397,274] was granted by the patent office on 2014-04-22 for grounded electrode for a plasma processing apparatus.
This patent grant is currently assigned to Hitachi High-Technologies Corporation. The grantee listed for this patent is Hidenobu Tanimura. Invention is credited to Hidenobu Tanimura.
United States Patent |
D703,160 |
Tanimura |
April 22, 2014 |
Grounded electrode for a plasma processing apparatus
Claims
CLAIM I claim the ornamental design for a grounded electrode for a
plasma processing apparatus, as shown.
Inventors: |
Tanimura; Hidenobu (Kudamatsu,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Tanimura; Hidenobu |
Kudamatsu |
N/A |
JP |
|
|
Assignee: |
Hitachi High-Technologies
Corporation (Tokyo, JP)
|
Appl.
No.: |
D/397,274 |
Filed: |
July 14, 2011 |
Foreign Application Priority Data
|
|
|
|
|
Jan 27, 2011 [JP] |
|
|
2011-001651 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/158,177,184,182
;D7/397 ;204/286.1,297.01 ;205/118,123
;200/1R,5R,52R,315,310,6A,302.1,308,314,11R,16B |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Antonelli, Terry, Stout &
Kraus, LLP.
Description
FIG. 1 is a front and bottom perspective view of a grounded
electrode for a plasma processing apparatus showing our/my new
design;
FIG. 2 is a front elevational view thereof with explanatory cut
lines 8-8;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along 8-8.
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