Cover of an electronic device having surface ornamentation

Li February 25, 2

Patent Grant D700174

U.S. patent number D700,174 [Application Number D/418,372] was granted by the patent office on 2014-02-25 for cover of an electronic device having surface ornamentation. This patent grant is currently assigned to FIH (Hong Kong) Limited. The grantee listed for this patent is Bin Li. Invention is credited to Bin Li.


United States Patent D700,174
Li February 25, 2014

Cover of an electronic device having surface ornamentation

Claims

CLAIM The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
Inventors: Li; Bin (Shenzhen, CN)
Applicant:
Name City State Country Type

Li; Bin

Shenzhen

N/A

CN
Assignee: FIH (Hong Kong) Limited (Kowloon, HK)
Appl. No.: D/418,372
Filed: April 16, 2012

Current U.S. Class: D14/248
Current International Class: 1403
Field of Search: ;D14/138AA,138AB,138AC,138AD,138G,138R,140,168,169,172,203,217,218,238.1,240,247,248,250,251,253,341,342,344,345,346,347,439,440,496 ;D5/46,53,56,58,99 ;D3/201,248,269,273,301,303 ;206/320 ;355/29 ;D25/142,156 ;D21/349,365,478 ;359/514,529,530 ;428/156

References Cited [Referenced By]

U.S. Patent Documents
586211 July 1897 Basquin
D46761 December 1914 Tyrrell
D108262 February 1938 Harvey
3922065 November 1975 Schultz
3924929 December 1975 Holmen et al.
4511144 April 1985 Roberts
D313319 January 1991 Legare
D418308 January 2000 Lu
D436139 January 2001 Cummings
D478218 August 2003 Liang
D489905 May 2004 Hynnek et al.
D493622 August 2004 Hynnek et al.
7562991 July 2009 Benson et al.
7712904 May 2010 Benson et al.
D618368 June 2010 Jenkins et al.
D666837 September 2012 Elser
D671231 November 2012 Reid
8394485 March 2013 Benson et al.
8485672 July 2013 Benson et al.
2010/0028709 February 2010 Li et al.
2011/0234063 September 2011 Li et al.
2013/0215509 August 2013 Mimura

Other References

Signicase, Diamond and Cubes Case for iPhone,< http://www.signicase.com/collections/iphone-5-5s/products/wood-case-iphon- e5-bamboo-diamonds-and-cubes>, retrieved from internet on Dec. 12, 2013, 2013 copyright catalog. cited by examiner.

Primary Examiner: Deshmukh; Prabhakar
Assistant Examiner: Sealey; Chelsea
Attorney, Agent or Firm: Altis Law Group, Inc.

Description



The present application is related to co-pending U.S. patent applications Ser. No. 29/418,361, 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,373, 29/418,375, and 29/418,377, each, entitled "Cover of an Electronic Device Having Surface Ornamentation", by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIG. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

* * * * *

References


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