U.S. patent number D679,682 [Application Number D/371,528] was granted by the patent office on 2013-04-09 for earphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Keiko Densho, Sohei Kitayama, Jun Komiyama, So Morimoto, Naoto Shimizu, Yosuke Shimizu, Naoki Sugiyama. Invention is credited to Keiko Densho, Sohei Kitayama, Jun Komiyama, So Morimoto, Naoto Shimizu, Yosuke Shimizu, Naoki Sugiyama.
United States Patent |
D679,682 |
Shimizu , et al. |
April 9, 2013 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Shimizu; Yosuke (Tokyo,
JP), Densho; Keiko (Tokyo, JP), Sugiyama;
Naoki (Tokyo, JP), Kitayama; Sohei (Tokyo,
JP), Morimoto; So (Tokyo, JP), Shimizu;
Naoto (Tokyo, JP), Komiyama; Jun (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shimizu; Yosuke
Densho; Keiko
Sugiyama; Naoki
Kitayama; Sohei
Morimoto; So
Shimizu; Naoto
Komiyama; Jun |
Tokyo
Tokyo
Tokyo
Tokyo
Tokyo
Tokyo
Tokyo |
N/A
N/A
N/A
N/A
N/A
N/A
N/A |
JP
JP
JP
JP
JP
JP
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/371,528 |
Filed: |
April 4, 2011 |
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29347499 |
Feb 12, 2010 |
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Foreign Application Priority Data
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Aug 31, 2007 [JP] |
|
|
D2007-023857 |
Aug 31, 2007 [JP] |
|
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D2007-023863 |
Aug 31, 2007 [JP] |
|
|
D2007-023864 |
Aug 31, 2007 [JP] |
|
|
D2007-023865 |
Jul 4, 2008 [JP] |
|
|
D2008-017355 |
Jul 4, 2008 [JP] |
|
|
D2008-017356 |
Jul 31, 2008 [JP] |
|
|
D2008-019806 |
|
Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,223
;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.2
;D13/156,148,184,133,137.4 ;119/819 ;128/879 ;D8/399 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
D1057368 |
|
Jan 2000 |
|
JP |
|
D1084542 |
|
Sep 2000 |
|
JP |
|
D1124139 |
|
Oct 2001 |
|
JP |
|
D1337824 |
|
Aug 2008 |
|
JP |
|
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a front, top, right perspective view of an earphone
showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
* * * * *