Heat-dissipating radiators for electronic apparatus
Lee March 12, 2
U.S. patent number D677,636 [Application Number D/407,175] was granted by the patent office on 2013-03-12 for heat-dissipating radiators for electronic apparatus. This patent grant is currently assigned to Zaonzi Co., Ltd.. The grantee listed for this patent is Sangcheol Lee. Invention is credited to Sangcheol Lee.
| United States Patent | D677,636 |
| Lee | March 12, 2013 |
Heat-dissipating radiators for electronic apparatus
Claims
CLAIM The ornamental design for the heat-dissipating radiator for electronic apparatus, as shown and described.
| Inventors: | Lee; Sangcheol (Gyeonggi-do, KR) | ||||||||||
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| Applicant: |
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| Assignee: | Zaonzi Co., Ltd. (Seoul,
KR) |
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| Appl. No.: | D/407,175 | ||||||||||
| Filed: | November 23, 2011 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.26,104.33,122,151,185 ;257/706,707,718-722 ;361/695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| D481688 | November 2003 | Lee et al. |
| D511327 | November 2005 | Ma et al. |
| D541232 | April 2007 | Lee et al. |
| D541757 | May 2007 | Lee et al. |
| 7269013 | September 2007 | Chen et al. |
| D552564 | October 2007 | Mochizuki |
| D561711 | February 2008 | Lin |
| D573109 | July 2008 | Mochizuki et al. |
| D579421 | October 2008 | Chu |
| D604704 | November 2009 | Jung et al. |
| 2006/0213642 | September 2006 | Lai |
| 2009/0002995 | January 2009 | Lee et al. |
| 2009/0071637 | March 2009 | Liao |
| 2012/0118536 | May 2012 | Huang |
Attorney, Agent or Firm: Grossman Tucker Perreault & Pfleger, PLLC
Description
FIG. 1 is a top perspective view of a heat-dissipating radiator for electronic apparatus.
FIG. 2 is a front view thereof.
FIG. 3 is a rear view thereof.
FIG. 4 is a left side view thereof.
FIG. 5 is a right side view thereof.
FIG. 6 is a top plan view thereof.
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
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