Heat sink
Lin February 12, 2
U.S. patent number D561,711 [Application Number D/275,687] was granted by the patent office on 2008-02-12 for heat sink. This patent grant is currently assigned to Thermaltake Technology Co., Ltd.. Invention is credited to Pei-Hsi Lin.
| United States Patent | D561,711 |
| Lin | February 12, 2008 |
Heat sink
Claims
CLAIM The ornamental design for a heat sink, as shown and described.
| Inventors: | Lin; Pei-Hsi (Sijhih, TW) |
|---|---|
| Assignee: | Thermaltake Technology Co.,
Ltd. (TW) |
| Appl. No.: | D/275,687 |
| Filed: | January 4, 2007 |
Foreign Application Priority Data
| Dec 8, 2006 [TW] | 095306823 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| D480692 | October 2003 | Lee |
| 6883592 | April 2005 | Lee |
| D541757 | May 2007 | Lee |
| 2002/0182068 | December 2002 | Liu |
| 2005/0067144 | March 2005 | Chou |
| 2006/0061970 | March 2006 | Lee |
| 2006/0082972 | April 2006 | Kim |
| 2006/0137861 | June 2006 | Wang et al. |
Attorney, Agent or Firm: Schmeiser, Olsen & Watts
Description
FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a front elevation thereof;
FIG. 3 is a rear elevation thereof;
FIG. 4 is a left side elevation thereof;
FIG. 5 is a right side elevation thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.
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