Chip assembly

Description

FIG. 1 is a top and front perspective view of a chip assembly showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a front view thereof;

FIG. 7 is a rear view thereof; and,

FIG. 8 is a bottom and rear perspective view thereof.

Claims

CLAIM The ornamental design for a chip assembly, as shown.

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Inventors:	Segler; Ken (North Las Vegas, NV), Cachia; Joseph (Las Vegas, NV)
Applicant:	Name City State Country Type Segler; Ken Cachia; Joseph North Las Vegas Las Vegas NV NV US US
Assignee:	Uninet Imaging, Inc. (Hawthorne, CA)
Appl. No.:	D/396,216
Filed:	June 27, 2011

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,133 ;174/528,531,533,536,537 ;257/666,670,678,690,692,734,735

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References Cited [Referenced By]

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U.S. Patent Documents

5469074	November 1995	Drabenstadt et al.
D475028	May 2003	Hori et al.
D489338	May 2004	Seddon et al.
D504874	May 2005	Celaya et al.
D510728	October 2005	Celaya et al.
D514074	January 2006	Kamidoi et al.
D560623	January 2008	Harnden et al.
7701723	April 2010	Peng et al.
D639253	June 2011	Tsai et al.
D648290	November 2011	Mori
2004/0242046	December 2004	Ohtsuki et al.
2005/0087848	April 2005	Yoon et al.
2009/0230537	September 2009	Liu et al.

Primary Examiner: Johannes; Thomas
Attorney, Agent or Firm: Hankin; Marc E. Schraven; Kevin Hankin Patent Law, APC