Boat of wafer processing apparatus

Takebayashi , et al. March 13, 2

Patent Grant D655682

U.S. patent number D655,682 [Application Number D/378,011] was granted by the patent office on 2012-03-13 for boat of wafer processing apparatus. This patent grant is currently assigned to Hitachi Kokusai Electric Inc.. Invention is credited to Tsutomu Kato, Satoshi Okada, Tatsuyuki Saito, Yuji Takebayashi, Tetsuo Yamamoto.


United States Patent D655,682
Takebayashi ,   et al. March 13, 2012

Boat of wafer processing apparatus

Claims

CLAIM The ornamental design for a boat of a wafer processing apparatus, as shown and described.
Inventors: Takebayashi; Yuji (Toyama, JP), Saito; Tatsuyuki (Toyama, JP), Yamamoto; Tetsuo (Toyama, JP), Kato; Tsutomu (Toyama, JP), Okada; Satoshi (Toyama, JP)
Assignee: Hitachi Kokusai Electric Inc. (Tokyo, JP)
Appl. No.: D/378,011
Filed: October 28, 2010

Foreign Application Priority Data

Jun 18, 2010 [JP] 2010-015045
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;D15/144,144.1,199 ;118/715 ;211/41.18 ;432/253,258

References Cited [Referenced By]

U.S. Patent Documents
4407654 October 1983 Irwin
5310339 May 1994 Ushikawa
5482558 January 1996 Watanabe et al.
D404372 January 1999 Ishii
D409158 May 1999 Shimazu
D411176 June 1999 Shimazu
6062853 May 2000 Shimazu et al.
6287112 September 2001 Van Voorst Vader et al.
6341935 January 2002 Tseng
6796439 September 2004 Araki
6966771 November 2005 Irie et al.
7033168 April 2006 Gupta et al.
7121414 October 2006 Beckhart et al.
D551634 September 2007 Sugawara
D570309 June 2008 Sato et al.
7484958 February 2009 Kobayashi
D616396 May 2010 Sato
7857140 December 2010 Shinjo et al.
7971734 July 2011 De Ridder et al.
2003/0024888 February 2003 Payne et al.
2005/0145584 July 2005 Buckley et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Volpe and Koenig, P.C.

Description



FIG. 1 is a perspective view 1 of a boat of the wafer processing apparatus;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an enlarged cross-sectional view thereof taken along lines 8-8 in FIG. 2;

FIG. 9 is a cross-sectional view thereof taken along lines 9-9 in FIG. 8; and,

FIG. 10 is a perspective view of the cross-section from FIG. 9.

The broken line showing of the boat of a wafer processing apparatus is for the purpose of illustrating environmental structure and forms no part of the claimed design.

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