U.S. patent number D616,393 [Application Number D/342,853] was granted by the patent office on 2010-05-25 for heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers.
This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Izumi Sato.
United States Patent |
D616,393 |
Sato |
May 25, 2010 |
Heat radiation fin of heat insulating cylinder for manufacturing
semiconductor wafers
Claims
CLAIM The ornamental design for a heat radiation fin of heat
insulating cylinder for manufacturing semiconductor wafers, as
shown and described.
Inventors: |
Sato; Izumi (Oshu,
JP) |
Assignee: |
Tokyo Electron Limited
(Minato-Ku, JP)
|
Appl.
No.: |
D/342,853 |
Filed: |
September 2, 2009 |
Foreign Application Priority Data
|
|
|
|
|
Mar 6, 2009 [JP] |
|
|
2009-004988 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;206/454,711
;118/728,729 ;211/41.18 ;432/241,253,258 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Burr & Brown
Description
FIG. 1 is front perspective view of a heat radiation fin of heat
insulating cylinder for manufacturing semiconductor wafers
illustrating my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a front perspective view of a heat radiation fin of heat
insulating cylinder for manufacturing semiconductor wafers in
use.
The broken lines are shown for illustrative purposes only and form
no part of the claimed design.
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