Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

Description

FIG. 1 is front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view thereof taken through line 8--8 of FIG. 6;

FIG. 9 is a cross-sectional view thereof taken through line 9--9 of FIG. 6; and,

FIG. 10 is a front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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Inventors:	Sato; Izumi (Oshu, JP)
Assignee:	Tokyo Electron Limited (Minato-Ku, JP)
Appl. No.:	D/342,852
Filed:	September 2, 2009

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Foreign Application Priority Data

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Mar 6, 2009 [JP]			2009-004987

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;206/454,711 ;118/728,729 ;211/41.18 ;432/241,253,258

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References Cited [Referenced By]

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U.S. Patent Documents

5421595	June 1995	Cripe et al.
D404372	January 1999	Ishii
6056123	May 2000	Niemirowski et al.
6062853	May 2000	Shimazu et al.
6110285	August 2000	Kitazawa et al.
7033168	April 2006	Gupta et al.
7484958	February 2009	Kobayashi
D600220	September 2009	Sato
2002/0113027	August 2002	Minami et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Burr & Brown