U.S. patent number D597,497 [Application Number D/290,286] was granted by the patent office on 2009-08-04 for heat dissipating module.
This patent grant is currently assigned to Delta Electronics Inc.. Invention is credited to Chin-Ming Chen, Sung-Ching Ho, Yu-Hung Huang, Chun-Yang Hung.
United States Patent |
D597,497 |
Chen , et al. |
August 4, 2009 |
Heat dissipating module
Claims
CLAIM The ornamental design for a heat dissipating module, as shown
and described herein.
Inventors: |
Chen; Chin-Ming (Taoyuan Hsien,
TW), Huang; Yu-Hung (Taoyuan Hsien, TW),
Hung; Chun-Yang (Taoyuan Hsien, TW), Ho;
Sung-Ching (Taoyuan Hsien, TW) |
Assignee: |
Delta Electronics Inc. (Taoyuan
Hsien, TW)
|
Appl.
No.: |
D/290,286 |
Filed: |
November 15, 2007 |
Foreign Application Priority Data
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|
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Oct 26, 2007 [TW] |
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96305815 |
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Current U.S.
Class: |
D13/179 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/179
;165/80.3,104.33,151,122,185 ;257/706,707,718-722
;361/687,695,697,700,702,704,709,710,711,719 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Description
FIG. 1 is a perspective view of a heat dissipating module showing
our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear eleavational view thereof;
FIG. 4 is a left side elevational view thereof; and
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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