U.S. patent number D266,082 [Application Number 06/154,984] was granted by the patent office on 1982-09-07 for heat releasing plate for mounting semiconductor components.
This patent grant is currently assigned to Showa Aluminum Kabushiki Kaisha. Invention is credited to Yoshihiko Asanuma.
United States Patent |
D266,082 |
Asanuma |
September 7, 1982 |
Heat releasing plate for mounting semiconductor components
Claims
The ornamental design for heat releasing plate for mounting
semiconductor components, as shown and described.
Inventors: |
Asanuma; Yoshihiko (Tochigi,
JP) |
Assignee: |
Showa Aluminum Kabushiki Kaisha
(Osaka, JP)
|
Appl.
No.: |
06/154,984 |
Filed: |
May 30, 1980 |
Foreign Application Priority Data
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|
|
|
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Mar 30, 1980 [TW] |
|
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6930605 |
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Current U.S.
Class: |
D13/179 |
Current International
Class: |
D1303 |
Field of
Search: |
;D13/23 ;165/8R,8A,8B,8D
;357/81 ;174/16HS |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Armstrong, Nikaido, Marmelstein
& Kubovcik
Description
FIG. 1 is a front view of the heat releasing plate for mounting
semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 1.
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