Heat dissipating module
Chen , et al. August 4, 2
U.S. patent number D597,497 [Application Number D/290,286] was granted by the patent office on 2009-08-04 for heat dissipating module. This patent grant is currently assigned to Delta Electronics Inc.. Invention is credited to Chin-Ming Chen, Sung-Ching Ho, Yu-Hung Huang, Chun-Yang Hung.
| United States Patent | D597,497 |
| Chen , et al. | August 4, 2009 |
Heat dissipating module
Claims
CLAIM The ornamental design for a heat dissipating module, as shown and described herein.
| Inventors: | Chen; Chin-Ming (Taoyuan Hsien, TW), Huang; Yu-Hung (Taoyuan Hsien, TW), Hung; Chun-Yang (Taoyuan Hsien, TW), Ho; Sung-Ching (Taoyuan Hsien, TW) |
|---|---|
| Assignee: | Delta Electronics Inc. (Taoyuan
Hsien, TW) |
| Appl. No.: | D/290,286 |
| Filed: | November 15, 2007 |
Foreign Application Priority Data
| Oct 26, 2007 [TW] | 96305815 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| D266082 | September 1982 | Asanuma |
| 6446708 | September 2002 | Lai |
| D467559 | December 2002 | Lee |
| 6607028 | August 2003 | Wang et al. |
| 2006/0219392 | October 2006 | Lin |
| 2006/0225866 | October 2006 | Chen |
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP
Description
FIG. 1 is a perspective view of a heat dissipating module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear eleavational view thereof;
FIG. 4 is a left side elevational view thereof; and
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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