Heater for manufacturing semiconductor

Description

FIG. 1 is a front elevational view of a heater for manufacturing semiconductor, showing my new design;

FIG. 2 is a rear elevational view thereof; and,

FIG. 3 is a sectional view taken along line 3--3 in FIG. 1.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a heater for manufacturing semiconductor, as shown and described.

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Inventors:	Komatsu; Tomohito (Nirasaki, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/278,401
Filed:	March 28, 2007

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Foreign Application Priority Data

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Sep 28, 2006 [JP]			2006-026092

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D9/429 ;D7/566,570 ;118/724,725 ;219/390,544 ;392/418

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References Cited [Referenced By]

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U.S. Patent Documents

5540782	July 1996	Miyagi et al.
5911896	June 1999	Holden et al.
6037574	March 2000	Lanham et al.
D427570	July 2000	Ishii
D428858	August 2000	Ishii
6529686	March 2003	Ramanan et al.
6616767	September 2003	Zhao et al.
2002/0190051	December 2002	Wang et al.
2004/0149716	August 2004	Inagawa et al.
2005/0217583	October 2005	Cole et al.
2007/0166146	July 2007	Sekiya

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.