Heat dissipation deterrence link for semiconductor manufacture

Description

FIG. 1 is a front view of the design for a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along A--A of FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 shows a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention in use.

In practice, a heat dissipation deterrence link is placed on the bottom of a thermostat plug that is included in a process tube for semiconductor manufacture. Then, in use, the link suppresses heat from a bottom sub-heater. Preferably, the heat dissipation deterrence link for semiconductor manufacture in accordance with the present invention is fabricated from quartz.

The broken line showing the environment is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.

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Inventors:	Okada; Mitsuhiro (Tokyo, JP), Furusawa; Yoshikazu (Tokyo, JP), Suzuki; Daisuke (Tokyo, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/270,120
Filed:	December 15, 2006

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Foreign Application Priority Data

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Jun 16, 2006 [JP]			2006-015663

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D8/16 ;D23/386 ;118/724,725 ;432/241,242 ;438/680

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References Cited [Referenced By]

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U.S. Patent Documents

1637410	August 1927	Coryell
D93058	August 1934	Wagner
4803948	February 1989	Nakagawa et al.
5370736	December 1994	Roy et al.
5800616	September 1998	Persyn
5846073	December 1998	Weaver
6164963	December 2000	Weaver
6746240	June 2004	De Ridder et al.
D516318	March 2006	Hasenoehrl et al.
7211514	May 2007	Fujita et al.
2001/0050054	December 2001	Kwag et al.
2003/0175649	September 2003	Oosterlaken et al.
2003/0175650	September 2003	Ridder et al.
2004/0146827	July 2004	Beatty et al.
2008/0044785	February 2008	Anbai et al.

Other References

Mitsuhiro Okada, et al. entitled Heat Dissipation Deterrence Link for Semiconductor Manufacture. cited by other.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Smith, Gambrell & Russell, LLP