Heat sink
Otsuki , et al. July 15, 2
U.S. patent number D573,110 [Application Number D/282,736] was granted by the patent office on 2008-07-15 for heat sink. This patent grant is currently assigned to Nidec Corporation. Invention is credited to Akira Hirakawa, Takaya Otsuki, Takamasa Yamashita.
| United States Patent | D573,110 |
| Otsuki , et al. | July 15, 2008 |
Heat sink
Claims
CLAIM The ornamental design for a heat sink, as shown and described.
| Inventors: | Otsuki; Takaya (Kyoto, JP), Yamashita; Takamasa (Kyoto, JP), Hirakawa; Akira (Kyoto, JP) |
|---|---|
| Assignee: | Nidec Corporation (Kyoto,
JP) |
| Appl. No.: | D/282,736 |
| Filed: | July 27, 2007 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| 5519574 | May 1996 | Kodama et al. |
| 6269864 | August 2001 | Kabadi |
| 6411510 | June 2002 | Sasa et al. |
| 6470962 | October 2002 | Pao |
| D465462 | November 2002 | Hsieh |
| D465771 | November 2002 | Hsieh |
| 6480383 | November 2002 | Kodaira et al. |
| 6480387 | November 2002 | Lee et al. |
| D474754 | May 2003 | Tan et al. |
| 6621704 | September 2003 | Liu |
| D481017 | October 2003 | Hsia et al. |
| 6976525 | December 2005 | Lin |
| 2003/0121643 | July 2003 | Connors |
| 2005/0072558 | April 2005 | Whitney et al. |
| 2006/0056159 | March 2006 | Lee et al. |
| 2007/0074857 | April 2007 | Xia et al. |
| 2007/0277957 | December 2007 | Wu et al. |
| D1091315 | Nov 2000 | JP | |||
| D1091551 | Nov 2000 | JP | |||
| D1091552 | Nov 2000 | JP | |||
| D1168617 | Mar 2003 | JP | |||
| D1168855 | Mar 2003 | JP | |||
| D1205085 | May 2004 | JP | |||
Other References
|
"Weekly Ascii", Jun. 22, 2004, vol. 494, p. 156, published by Ascii Corporation, received by National Center for Industrial Property Information and Training on Jun. 8, 2004. cited by other . Official communication issued in the counterpart Japanese Application No. 2006-008877; mailed on Oct. 13, 2007. cited by other . Otsuki et al.; "Fan"; U.S. Appl. No. 29/249,373, filed Oct. 4, 2006. cited by other. |
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Keating & Bennett, LLP
Description
FIG. 1 is a front elevation view of a heat sink according to our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
* * * * *
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 