Base for a heat dissipating assembly
Hsieh November 12, 2
U.S. patent number D465,462 [Application Number D/145,500] was granted by the patent office on 2002-11-12 for base for a heat dissipating assembly. Invention is credited to Hsin-Mao Hsieh.
| United States Patent | D465,462 |
| Hsieh | November 12, 2002 |
Base for a heat dissipating assembly
Claims
The ornamental design for a base for a heat dissipating assembly, as shown.
| Inventors: | Hsieh; Hsin-Mao (Pingtung City, Pingtung Hsien, TW) |
|---|---|
| Appl. No.: | D/145,500 |
| Filed: | July 24, 2001 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;174/16.3 ;257/706,707,718,719,720,721,722,727,686 ;361/271,274.3,697,702,704,709,710,711 |
References Cited [Referenced By]
U.S. Patent Documents
| D315832 | April 1991 | Rocheleau et al. |
| 5368094 | November 1994 | Hung |
| D357670 | April 1995 | Dodson |
| 5495392 | February 1996 | Shen |
| 6161611 | December 2000 | Cheng |
| 6246584 | June 2001 | Lee et al. |
| D450044 | November 2001 | Lindstrom |
| 6373701 | April 2002 | Lo |
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Thorp Reed & Armstrong LLP
Description
FIG. 1 is a perspective view of a base for a heat dissipating assembly, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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