Attracting plate of an electrostatic chuck for semiconductor manufacturing

Description

FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, or the like, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof, the bottom plan view being a mirror image of the plan view shown;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof; and,

FIG. 6 is a bottom, rear and lower perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.

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Inventors:	Sasaki; Yasuharu (Nirasaki, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/276,679
Filed:	February 1, 2007

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Foreign Application Priority Data

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Aug 1, 2006 [JP]			2006-020298

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;156/345.53 ;279/128 ;361/234

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References Cited [Referenced By]

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U.S. Patent Documents

5671116	September 1997	Husain
6278600	August 2001	Shamouilian et al.
D546784	July 2007	Hayashi
D548200	August 2007	Hayashi
D548705	August 2007	Hayashi
2004/0212947	October 2004	Nguyen et al.
2005/0252447	November 2005	Zhao et al.
2006/0002053	January 2006	Brown et al.
2006/0221539	October 2006	Morita et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.