Heat sink

Yamashita , et al. May 13, 2

Patent Grant D568829

U.S. patent number D568,829 [Application Number D/249,552] was granted by the patent office on 2008-05-13 for heat sink. This patent grant is currently assigned to Nidec Corporation. Invention is credited to Yoshinori Inoue, Takamasa Yamashita.


United States Patent D568,829
Yamashita ,   et al. May 13, 2008

Heat sink

Claims

CLAIM The ornamental design for a heat sink, as shown and described.
Inventors: Yamashita; Takamasa (Kyoto, JP), Inoue; Yoshinori (Kyoto, JP)
Assignee: Nidec Corporation (Kyoto, JP)
Appl. No.: D/249,552
Filed: October 12, 2006

Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

References Cited [Referenced By]

U.S. Patent Documents
5794685 August 1998 Dean
6419007 July 2002 Ogawara et al.
D466871 December 2002 Lee
D480692 October 2003 Lee
6657862 December 2003 Crocker et al.
6671172 December 2003 Carter et al.
6714415 March 2004 Shah
6779593 August 2004 Hegde
D509484 September 2005 Mochizuki et al.
D509485 September 2005 Mochizuki et al.
7123483 October 2006 Otsuki et al.
7221567 May 2007 Otsuki et al.
2002/0017378 February 2002 Hu
2002/0046826 April 2002 Kao
2003/0131970 July 2003 Carter et al.
2004/0045702 March 2004 Barsun
2005/0056399 March 2005 Ku et al.
2005/0061480 March 2005 Carter et al.
2006/0060332 March 2006 Wang et al.
Foreign Patent Documents
D1186376 Sep 2003 JP
1237688 D Apr 2005 JP
1237951 D Apr 2005 JP
1237952 D Apr 2005 JP
1237953 D Apr 2005 JP
1295760 D Mar 2007 JP
1296655 D Mar 2007 JP
520966 Feb 2003 TW
D105452 Jul 2005 TW
D108216 Dec 2005 TW
D118870 Sep 2007 TW

Other References

Otsuki, Takaya et al., "Heat Sink Fan," U.S. Appl. No. 29/276,415, filed Jan. 25, 2007. cited by other .
Official communication issued in counterpart Taiwanese Application No. 96301805, mailed on Dec. 21, 2007. cited by other.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Keating & Bennett, LLP

Description



FIG. 1 is a front elevation view of a heat sink showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is another perspective view thereof.

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