IC memory card

Yamada , et al. March 14, 2

Patent Grant D517072

U.S. patent number D517,072 [Application Number D/169,127] was granted by the patent office on 2006-03-14 for ic memory card. This patent grant is currently assigned to Kabushikikaisha Toshiba, Matsushita Electric Industrial Co., Ltd., SanDisk Corporation. Invention is credited to Robert Miller, Yutaka Nakamura, Hiroyuki Sakamoto, Hem Takiar, Hiroyuki Yamada.


United States Patent D517,072
Yamada ,   et al. March 14, 2006

IC memory card

Claims

CLAIM The ornamental design for an IC memory card, as shown and described.
Inventors: Yamada; Hiroyuki (Hirakata, JP), Nakamura; Yutaka (Kyoto, JP), Sakamoto; Hiroyuki (Oume, JP), Takiar; Hem (Fremont, CA), Miller; Robert (San Jose, CA)
Assignee: Matsushita Electric Industrial Co., Ltd. (JP)
Kabushikikaisha Toshiba (JP)
SanDisk Corporation (Sunnyvale, CA)
Appl. No.: D/169,127
Filed: October 15, 2002

Current U.S. Class: D14/436
Current International Class: 1402
Field of Search: ;D14/432-439,478-480 ;361/736-737,686,752 ;257/678,679 ;40/124.01 ;283/75-76,901 ;235/489,495,441-443,375 ;174/52.1 ;439/135,140,76.1

References Cited [Referenced By]

U.S. Patent Documents
D444473 July 2001 Okamoto et al.
D445111 July 2001 Okamoto et al.
D446525 August 2001 Okamoto et al.
D475056 May 2003 Taniguchi et al.
D476011 June 2003 Taniguchi et al.
Foreign Patent Documents
1085565 Sep 2000 JP

Other References

US. Design Appl. No. 29/169,130 filed on Oct. 15, 2002, 38 pages. cited by other.

Primary Examiner: Chin; Kay H.
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione

Description



FIG. 1 is a perspective view of the first embodiment of an IC memory card showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross sectional view along the line 8--8 in FIG. 2;

FIG. 9 is a cross sectional view along the line 9--9 in FIG. 2;

FIG. 10 is a perspective view of a second embodiment of the IC memory card;

FIG. 11 is a front elevational view of FIG. 10;

FIG. 12 is a rear elevational view of FIG. 10;

FIG. 13 is a left side elevational view of FIG. 10;

FIG. 14 is a right side elevational view FIG. 10;

FIG. 15 is a top plan view of FIG. 10;

FIG. 16 is a bottom plan view of FIG. 10;

FIG. 17 is a cross sectional view taken along the line 17--17 in FIG. 11; and,

FIG. 18 is a cross sectional view taken along the line 18--18 in FIG. 11.

The interior details are omitted for clarity of illustration in FIGS. 8, 9, 17 and 18.

* * * * *


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