Cover for a semiconductor carrier

Description

FIG. 1 is a left, front perspective view of a cover for a semiconductor carrier showing our new design;

FIG. 2 is a front view of our new design, the rear view being a mirror image thereof;

FIG. 3 is a right-side view of our new design, the left-side view being a mirror image thereof;

FIG. 4 is a top view of our new design; and,

FIG. 5 is a bottom view of our new design.

The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a cover for a semiconductor carrier, as shown and described.

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Inventors:	Nakamura; Yuji (Tokyo, JP), Suzuki; Katsumi (Tokyo, JP), Ishibashi; Takahiro (Tokyo, JP), Kobori; Eiji (Tokyo, JP)
Assignee:	Yamaichi Electronics Co., Ltd. (Tokyo, JP)
Appl. No.:	D/229,566
Filed:	May 10, 2005

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29211532	Aug 18, 2004	D507545

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Foreign Application Priority Data

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Feb 20, 2004 [JP]			2004-004834

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/666,669,675,676 ;324/755

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References Cited [Referenced By]

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U.S. Patent Documents

D359028	June 1995	Siegel et al.
5451165	September 1995	Cearley-Cabbiness et al.
5519332	May 1996	Wood et al.
5541525	July 1996	Wood et al.
D401567	November 1998	Farnworth et al.
2001/0043074	November 2001	Hembree et al.
2004/0016993	January 2004	Ham et al.

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP