U.S. patent number D492,265 [Application Number D/181,164] was granted by the patent office on 2004-06-29 for thermal efficient heat sink for electronic devices.
This patent grant is currently assigned to Datech Technology Co., Ltd.. Invention is credited to Chin-Yueh Chu.
United States Patent |
D492,265 |
Chu |
June 29, 2004 |
Thermal efficient heat sink for electronic devices
Claims
The ornamental design for a thermal efficient heat sink for
electronic devices, as shown and described.
Inventors: |
Chu; Chin-Yueh (Hsin-Chuang,
TW) |
Assignee: |
Datech Technology Co., Ltd.
(Taipei Hsien, TW)
|
Appl.
No.: |
D/181,164 |
Filed: |
May 7, 2003 |
Foreign Application Priority Data
|
|
|
|
|
Apr 24, 2003 [TW] |
|
|
092302333 |
|
Current U.S.
Class: |
D13/179 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/179
;165/80.3,104.33,121,122,146,185
;257/697,706,707,712,718,719,720,721,722
;361/695,697,699,702,704,709,5,14 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Troxell Law Office PLLC
Description
FIG. 1 is a perspective view of a thermal efficient heat sink for
electronic devices, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
* * * * *